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DLP470TPAFQN

Texas Instruments

DLP470TPAFQN by Texas Instruments

DLP470TPAFQN by Texas Instruments is a rectangular grid array IC with 250 terminals. It operates b/w -20°C to 90°C, with supply voltage ranging from 1.65V to 1.95V. This consumer circuit IC is ideal for applications requiring high precision and reliability in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,910 parts In-Stock

1+ parts

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4,910

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Digiode

USA . 1,061 parts In-Stock

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1,061

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,158 parts In-Stock

1+ parts

$0.773

100+ parts

-

1k+ parts

$1.767

10k+ parts

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2,158

$0.773

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$1.767

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DigiPath Technology Company

USA . 414 parts In-Stock

1+ parts

$0.852

100+ parts

$0.783

1k+ parts

-

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414

$0.852

$0.783

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ChromeModa Solutions

Germany . 5,007 parts In-Stock

1+ parts

$0.869

100+ parts

$0.713

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5,007

$0.869

$0.713

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IDEA Electronic Components Group

UK . 1,069 parts In-Stock

1+ parts

$0.869

100+ parts

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1k+ parts

$0.782

10k+ parts

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1,069

$0.869

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$0.782

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Northwest PG Solutions

USA . 1,078 parts In-Stock

1+ parts

$2.421

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1,078

$2.421

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One Stop Electronics

USA . 326 parts In-Stock

1+ parts

$12.800

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326

$12.800

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AZTECH Wire

Italy . 631 parts In-Stock

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$13.770

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631

$13.770

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Native Components

USA . 933 parts In-Stock

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$2.135

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933

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$2.135

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Microchip USA

USA . 230 parts In-Stock

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230

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Corphita

USA . 154 parts In-Stock

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154

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Overview

Unlock a world of possibilities with the Texas Instruments DLP470TPAFQN. Known for their top-quality products, Texas Instruments delivers cutting-edge solutions in the category of Other Function Consumer ICs. This product boasts a package body material of CERAMIC, METAL-SEALED COFIRED, ensuring durability and reliability. With a compact rectangular shape and 250 terminals, this consumer circuit offers endless applications. From entertainment systems to automotive technology, the DLP470TPAFQN provides exceptional performance and value to customers seeking innovation and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability of the product, making it a good choice for long-term use.

Surface Mount: YES

Being surface mountable makes installation and replacement of the IC easier and more convenient, making this product a good choice for streamlined manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, making this product a good choice for compact electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed for consumer circuits, this IC is versatile and suitable for a wide range of consumer electronics applications, making it a good choice for various projects.

No. of Terminals: 250

With a high number of terminals, this IC can accommodate complex circuit configurations, making it a good choice for intricate electronic designs.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved electrical performance and thermal management, making this product a good choice for high-performance applications.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this IC can withstand extreme conditions, making it a good choice for applications that require reliable performance in harsh environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature range ensures that the IC can function in cold environments, making it a good choice for a variety of temperature-sensitive applications.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish provides excellent conductivity and corrosion resistance, making this product a good choice for maintaining signal integrity over time.

Terminal Position: BOTTOM

The bottom terminal position allows for easy connection to the circuit board, making installation and maintenance straightforward, making this product a good choice for efficient assembly processes.

Maximum Seated Height: 4.208 mm

With a low seated height, this IC can be accommodated in slim electronic devices, making it a good choice for compact designs that require space-saving solutions.

Width: 16.9 mm

The moderate width of this IC allows for versatility in placement on the circuit board, making it a good choice for various layouts and configurations.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement ensures energy efficiency and power savings, making this product a good choice for battery-powered devices or applications with strict power constraints.

Length: 25.65 mm

The length of this IC provides ample space for circuit connections and components, making it a good choice for designs that require multiple connections or functionalities in a compact form factor.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and is environmentally friendly, making this product a good choice for eco-conscious designs.

Maximum Supply Voltage (Vsup): 1.95 V

The low maximum supply voltage requirement ensures safety and prevents damage to the IC, making this product a good choice for applications where voltage regulation is critical.

Technical Specifications

Other Function Consumer ICs DLP470TPAFQN attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-N250

JESD-609 Code:

e4

Length:

25.65 mm

No. of Functions:

1

No. of Terminals:

250

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Equivalence Code:

LGA250,25X16

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

4.208 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Position:

BOTTOM

Width:

16.9 mm

Trade Compliance

DLP470TPAFQN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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