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CSD87384MT

Texas Instruments

CSD87384MT by Texas Instruments

CSD87384MT by Texas Instruments is an N-CHANNEL power FET with a min DS breakdown voltage of 30V. It is designed for switching applications and has a max pulsed drain current of 95A.

Median Price

$2.067

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 960 parts In-Stock

1+ parts

$1.624

100+ parts

$1.341

1k+ parts

$0.725

10k+ parts

-

960

$1.624

$1.341

$0.725

-

Mouser Electronics

USA . 316 parts In-Stock

1+ parts

$2.510

100+ parts

$1.420

1k+ parts

$1.100

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-

316

$2.510

$1.420

$1.100

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Distributors (In-Stock)

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Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$1.157

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45

$1.157

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Digiode

USA . 2,529 parts In-Stock

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$1.543

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2,529

$1.543

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Chip Stock

USA . 41,000 parts In-Stock

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41,000

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Vyrian

USA . 8,508 parts In-Stock

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8,508

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,345 parts In-Stock

1+ parts

$1.157

100+ parts

-

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10k+ parts

$1.134

5,345

$1.157

-

-

$1.134

Argo Parts USA

USA . 1,357 parts In-Stock

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$1.157

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1,357

$1.157

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Parana Technologies

USA . 535 parts In-Stock

1+ parts

$1.375

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$2.094

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535

$1.375

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$2.094

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Ampacity Inc.

Singapore . 639 parts In-Stock

1+ parts

$1.380

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639

$1.380

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Corphita

USA . 3,146 parts In-Stock

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$1.462

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$1.462

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DigiPath Technology Company

USA . 971 parts In-Stock

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$1.514

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$1.393

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971

$1.514

$1.393

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ChromeModa Solutions

Germany . 6,144 parts In-Stock

1+ parts

$1.545

100+ parts

$1.267

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6,144

$1.545

$1.267

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IDEA Electronic Components Group

UK . 1,717 parts In-Stock

1+ parts

$1.545

100+ parts

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1k+ parts

$1.390

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1,717

$1.545

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$1.390

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A-Z Elektronik GmbH

Germany . 500 parts In-Stock

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500

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Netroflash

USA . 100 parts In-Stock

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$1.134

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$1.099

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$1.076

100

-

$1.134

$1.099

$1.076

Overview

Experience the power and reliability of Texas Instruments with the CSD87384MT Power Field Effect Transistor. Designed to deliver exceptional performance, this N-CHANNEL transistor is perfect for switching applications. Its high-quality construction and advanced technology ensure reliable operation even in demanding conditions. With a minimum DS Breakdown Voltage of 30V and a maximum Pulsed Drain Current of 95A, this transistor offers unmatched power capabilities. Whether you're designing industrial machinery or automotive systems, the CSD87384MT will provide the efficiency and durability you need. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and lightweight, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making them a popular choice for switching applications.

Minimum DS Breakdown Voltage: 30 V

With a high minimum breakdown voltage, this FET can handle higher voltage levels, providing reliability in demanding switching applications.

Maximum Pulsed Drain Current (IDM): 95 A

The high pulsed drain current rating allows this FET to handle high power loads efficiently.

Avalanche Energy Rating (EAS): 231 mJ

The high avalanche energy rating indicates that this FET can withstand voltage surges and protect the circuit from damage.

Maximum Drain-Source On Resistance: 0.0089 ohm

The low on-resistance ensures minimal power loss and efficient operation of the FET.

Technical Specifications

Power Field Effect Transistors (FET) CSD87384MT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Avalanche Energy Rating (EAS):

231 mJ

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain-Source On Resistance:

.0089 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

114 pF

JESD-30 Code:

R-PBGA-B5

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

95 A

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

BUTT

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD87384MT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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