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CSD85302LT

Texas Instruments

CSD85302LT by Texas Instruments

CSD85302LT by Texas Instruments is an N-channel FET with 20V DS breakdown voltage. It features common drain configuration, 2 elements with built-in diode, and operates in enhancement mode for switching applications. This MOSFET has a max operating temperature of 150°C and min of -55°C, making it suitable for various power management tasks.

Median Price

$0.382

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 36 parts In-Stock

1+ parts

$0.308

100+ parts

$0.111

1k+ parts

-

10k+ parts

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36

$0.308

$0.111

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Chip1Stop

Japan . 500 parts In-Stock

1+ parts

$0.382

100+ parts

-

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500

$0.382

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Texas Instruments

USA . 42,643 parts In-Stock

1+ parts

$0.970

100+ parts

$0.659

1k+ parts

$0.338

10k+ parts

-

42,643

$0.970

$0.659

$0.338

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DigiKey

USA . 3,735 parts In-Stock

1+ parts

$1.710

100+ parts

$0.726

1k+ parts

$0.543

10k+ parts

$0.470

3,735

$1.710

$0.726

$0.543

$0.470

Verical

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$0.111

1k+ parts

-

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36

-

$0.111

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,343 parts In-Stock

1+ parts

$0.300

100+ parts

-

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3,343

$0.300

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.745

100+ parts

-

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900

$0.745

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Vyrian

USA . 9,214 parts In-Stock

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-

100+ parts

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9,214

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,801 parts In-Stock

1+ parts

$0.284

100+ parts

-

1k+ parts

-

10k+ parts

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3,801

$0.284

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-

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Ampacity Inc.

Singapore . 9,035 parts In-Stock

1+ parts

$0.287

100+ parts

-

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9,035

$0.287

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

$0.701

10k+ parts

-

2,000

$0.730

-

$0.701

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Argo Parts USA

USA . 4,513 parts In-Stock

1+ parts

$0.745

100+ parts

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10k+ parts

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4,513

$0.745

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Continental Prestige Electronics

USA . 3,662 parts In-Stock

1+ parts

$0.745

100+ parts

-

1k+ parts

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10k+ parts

$0.730

3,662

$0.745

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-

$0.730

Parana Technologies

USA . 553 parts In-Stock

1+ parts

$1.418

100+ parts

-

1k+ parts

$2.116

10k+ parts

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553

$1.418

-

$2.116

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DigiPath Technology Company

USA . 1,487 parts In-Stock

1+ parts

$1.561

100+ parts

$1.436

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1,487

$1.561

$1.436

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IDEA Electronic Components Group

UK . 732 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

$1.434

10k+ parts

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732

$1.593

-

$1.434

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ChromeModa Solutions

Germany . 131 parts In-Stock

1+ parts

$1.593

100+ parts

$1.306

1k+ parts

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131

$1.593

$1.306

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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100+ parts

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15,000

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Overview

Experience the unbeatable quality and reliability of Texas Instruments with the CSD85302LT Power Field Effect Transistor. Designed for switching applications, this N-Channel FET boasts a common drain configuration with built-in diode elements, offering unmatched performance in a compact square package. Ideal for a wide range of electronic devices, this transistor ensures efficient power management and seamless operation. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and superior results for all your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher current carrying capability, making them efficient for switching applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

Common drain configuration allows for high input impedance and low output impedance, and the built-in diode enhances efficiency and protection in certain circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in controlling power flow.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and enabling automated manufacturing processes.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can handle demanding environments without overheating.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures reliability in both high and low temperature conditions.

Technical Specifications

Power Field Effect Transistors (FET) CSD85302LT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

20 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

79 pF

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD85302LT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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