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CSD23280F3

Texas Instruments

CSD23280F3 by Texas Instruments

CSD23280F3 by Texas Instruments is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 11.4A IDM, 0.25 ohm Drain-Source Resistance, and -55 to 150°C Operating Temperature range. Suitable for Surface Mounting with PLASTIC/EPOXY body material and SILICON element.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 98,969 parts In-Stock

1+ parts

$0.108

100+ parts

$0.070

1k+ parts

$0.035

10k+ parts

-

98,969

$0.108

$0.070

$0.035

-

Arrow

USA . 1,355 parts In-Stock

1+ parts

$0.156

100+ parts

$0.058

1k+ parts

$0.052

10k+ parts

-

1,355

$0.156

$0.058

$0.052

-

DigiKey

USA . 39,646 parts In-Stock

1+ parts

$0.340

100+ parts

$0.130

1k+ parts

$0.085

10k+ parts

$0.061

39,646

$0.340

$0.130

$0.085

$0.061

Mouser Electronics

USA . 4,454 parts In-Stock

1+ parts

$0.340

100+ parts

$0.130

1k+ parts

$0.082

10k+ parts

-

4,454

$0.340

$0.130

$0.082

-

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.087

1k+ parts

$0.049

10k+ parts

-

2,000

-

$0.087

$0.049

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Verical

USA . 1,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.052

10k+ parts

-

1,355

-

-

$0.052

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Distributors (In-Stock)

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Vyrian

USA . 1,095 parts In-Stock

1+ parts

$0.049

100+ parts

-

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-

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1,095

$0.049

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-

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Digiode

USA . 675 parts In-Stock

1+ parts

$0.103

100+ parts

-

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675

$0.103

-

-

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Maritex

Poland . 1,043 parts In-Stock

1+ parts

$0.116

100+ parts

$0.057

1k+ parts

$0.052

10k+ parts

$0.046

1,043

$0.116

$0.057

$0.052

$0.046

Cyclops Electronics Ltd

UK . 32,701 parts In-Stock

1+ parts

-

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32,701

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Distributors (Availability)

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Corphita

USA . 2,070 parts In-Stock

1+ parts

$0.097

100+ parts

-

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2,070

$0.097

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-

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Native Components

USA . 975 parts In-Stock

1+ parts

$0.538

100+ parts

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975

$0.538

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Northwest PG Solutions

USA . 495 parts In-Stock

1+ parts

$0.592

100+ parts

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495

$0.592

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Parana Technologies

USA . 1,619 parts In-Stock

1+ parts

$1.515

100+ parts

-

1k+ parts

$2.177

10k+ parts

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1,619

$1.515

-

$2.177

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DigiPath Technology Company

USA . 926 parts In-Stock

1+ parts

$1.668

100+ parts

$1.535

1k+ parts

-

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926

$1.668

$1.535

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ChromeModa Solutions

Germany . 1,761 parts In-Stock

1+ parts

$1.702

100+ parts

$1.396

1k+ parts

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1,761

$1.702

$1.396

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IDEA Electronic Components Group

UK . 1,460 parts In-Stock

1+ parts

$1.702

100+ parts

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1k+ parts

$1.532

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1,460

$1.702

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$1.532

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Futuretech Components

Singapore . 24,000 parts In-Stock

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24,000

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A-Z Elektronik GmbH

Germany . 14,463 parts In-Stock

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ChipstoGo Electronic ltd

UK . 10,367 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 8,000 parts In-Stock

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8,000

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Kepictronics

USA . 5,003 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,842 parts In-Stock

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4,842

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GreenTree Electronics

Israel . 374 parts In-Stock

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374

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Lixinc

USA . 252 parts In-Stock

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252

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Overview

Unleash the power of innovation with the CSD23280F3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unrivaled quality and reliability. The CSD23280F3 belongs to the Power Field Effect Transistors category, offering seamless switching capabilities for a wide range of applications. With its built-in diode and resistor, this P-Channel transistor ensures optimal performance and efficiency. Experience the value of superior technology with the CSD23280F3, providing customers with unmatched benefits and advantages for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and protection for the transistor, making it durable and reliable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-resistance and high current-carrying capability, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Having a built-in diode and resistor simplifies the circuit design and saves space, making it easier to integrate into your application.

Transistor Application: SWITCHING

Designed for switching applications, this transistor is capable of handling high-frequency switching with high efficiency.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making it ideal for applications where space is a constraint.

Minimum DS Breakdown Voltage: 12 V

With a minimum breakdown voltage of 12V, this transistor can handle higher voltages, providing more flexibility in circuit design.

Maximum Pulsed Drain Current (IDM): 11.4 A

Capable of handling high pulsed drain currents, this transistor is suitable for applications requiring short bursts of high current.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can operate in high-temperature environments without any issues.

Maximum Drain-Source On Resistance: 0.25 ohm

Low on-resistance results in reduced power loss and higher efficiency in the circuit, making this transistor an excellent choice for power applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD23280F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

1.8 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11.1 pF

JESD-30 Code:

R-PBGA-B3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

11.4 A

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD23280F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.40

SB

8541.21.00.40

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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