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CSD22205LT

Texas Instruments

CSD22205LT by Texas Instruments

CSD22205LT by Texas Instruments is a P-CHANNEL FET with 8V DS Breakdown Voltage, 71A IDM, and 0.04 ohm RDS(on). Ideal for SWITCHING applications, it features SINGLE configuration with BUILT-IN DIODE and RESISTOR. Operating from -55 to 150 °C, it's a METAL-OXIDE SEMICONDUCTOR FET in PLASTIC/EPOXY package.

Median Price

$1.352

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,356 parts In-Stock

1+ parts

$0.933

100+ parts

$0.634

1k+ parts

$0.325

10k+ parts

-

13,356

$0.933

$0.634

$0.325

-

DigiKey

USA . 28,735 parts In-Stock

1+ parts

$1.770

100+ parts

$0.756

1k+ parts

$0.567

10k+ parts

$0.447

28,735

$1.770

$0.756

$0.567

$0.447

Mouser Electronics

USA . 3,010 parts In-Stock

1+ parts

$1.770

100+ parts

$0.571

1k+ parts

$0.509

10k+ parts

-

3,010

$1.770

$0.571

$0.509

-

Verical

USA . 132 parts In-Stock

1+ parts

-

100+ parts

$0.124

1k+ parts

-

10k+ parts

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132

-

$0.124

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,696 parts In-Stock

1+ parts

$0.124

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-

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-

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2,696

$0.124

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-

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Digiode

USA . 3,135 parts In-Stock

1+ parts

$0.542

100+ parts

-

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-

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3,135

$0.542

-

-

-

Nova Conductors

Japan . 67 parts In-Stock

1+ parts

$1.787

100+ parts

-

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-

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67

$1.787

-

-

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Chip Stock

USA . 17,880 parts In-Stock

1+ parts

-

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17,880

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Electronics Depot

USA . 250 parts In-Stock

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-

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250

-

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 505 parts In-Stock

1+ parts

$0.328

100+ parts

-

1k+ parts

-

10k+ parts

$0.315

505

$0.328

-

-

$0.315

Northwest PG Solutions

USA . 1,978 parts In-Stock

1+ parts

$0.361

100+ parts

-

1k+ parts

-

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$0.318

1,978

$0.361

-

-

$0.318

Corphita

USA . 393 parts In-Stock

1+ parts

$0.513

100+ parts

-

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393

$0.513

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Parana Technologies

USA . 2,325 parts In-Stock

1+ parts

$0.954

100+ parts

-

1k+ parts

$1.857

10k+ parts

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2,325

$0.954

-

$1.857

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DigiPath Technology Company

USA . 1,163 parts In-Stock

1+ parts

$1.051

100+ parts

$0.967

1k+ parts

-

10k+ parts

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1,163

$1.051

$0.967

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ChromeModa Solutions

Germany . 2,607 parts In-Stock

1+ parts

$1.072

100+ parts

$0.879

1k+ parts

-

10k+ parts

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2,607

$1.072

$0.879

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IDEA Electronic Components Group

UK . 460 parts In-Stock

1+ parts

$1.072

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$0.965

10k+ parts

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460

$1.072

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$0.965

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Microchip USA

USA . 4,388 parts In-Stock

1+ parts

$4.564

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4,388

$4.564

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Lixinc

USA . 975 parts In-Stock

1+ parts

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975

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Kepictronics

USA . 860 parts In-Stock

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860

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Overview

Experience the superior quality and reliability of the CSD22205LT by Texas Instruments, a leading manufacturer in the field of Power Field Effect Transistors. Perfect for switching applications, this P-Channel transistor offers built-in diode and resistor for added convenience. With a maximum drain current of 7.4A and low on-resistance, this transistor delivers exceptional performance. Whether you're designing circuits for automotive, industrial or consumer electronics, the CSD22205LT provides the value, benefits, and advantages you need to bring your projects to life. Trust Texas Instruments for cutting-edge technology and unmatched quality in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the internal components of the FET, making it suitable for rugged environments.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low gate capacitance and high input impedance, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 8 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 71 A

The high pulsed drain current capability allows the FET to handle heavy loads during short duration pulses.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, making the FET efficient for switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures the FET can withstand elevated temperatures without performance degradation.

Maximum Drain-Source On Resistance: 0.04 ohm

The low on-resistance results in minimal power loss and efficient operation of the FET.

Technical Specifications

Power Field Effect Transistors (FET) CSD22205LT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (ID):

7.4 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

250 pF

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

71 A

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD22205LT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.40

SB

8541.21.00.40

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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