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CSD25485F5T

Texas Instruments

CSD25485F5T by Texas Instruments

CSD25485F5T by Texas Instruments is a P-CHANNEL FET for switching applications. It features a 20V DS breakdown voltage, 31A max pulsed drain current, and 0.07 ohm max drain-source resistance. With a chip carrier package style, it operates in temperatures ranging from -55 to 150 °C and has a built-in diode and resistor for enhanced performance.

Median Price

$1.192

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$0.015

100+ parts

-

1k+ parts

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3

$0.015

-

-

-

Texas Instruments

USA . 3,465 parts In-Stock

1+ parts

$0.835

100+ parts

$0.567

1k+ parts

$0.291

10k+ parts

-

3,465

$0.835

$0.567

$0.291

-

DigiKey

USA . 1,145 parts In-Stock

1+ parts

$1.550

100+ parts

$0.651

1k+ parts

$0.484

10k+ parts

$0.379

1,145

$1.550

$0.651

$0.484

$0.379

Mouser Electronics

USA . 377 parts In-Stock

1+ parts

$1.550

100+ parts

$0.565

1k+ parts

$0.435

10k+ parts

$0.420

377

$1.550

$0.565

$0.435

$0.420

Chip1Stop

Japan . 3 parts In-Stock

1+ parts

-

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-

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3

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Distributors (In-Stock)

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Digiode

USA . 933 parts In-Stock

1+ parts

$0.011

100+ parts

-

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933

$0.011

-

-

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Nova Conductors

Japan . 67 parts In-Stock

1+ parts

$0.389

100+ parts

-

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67

$0.389

-

-

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Chip Stock

USA . 100,440 parts In-Stock

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100,440

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Vyrian

USA . 1,151 parts In-Stock

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1,151

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,036 parts In-Stock

1+ parts

$0.010

100+ parts

-

1k+ parts

-

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1,036

$0.010

-

-

-

Corphita

USA . 4,287 parts In-Stock

1+ parts

$0.011

100+ parts

-

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4,287

$0.011

-

-

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Semicontronic

India . 844 parts In-Stock

1+ parts

$0.013

100+ parts

$0.013

1k+ parts

$0.013

10k+ parts

-

844

$0.013

$0.013

$0.013

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.381

100+ parts

-

1k+ parts

$0.366

10k+ parts

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2,000

$0.381

-

$0.366

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Continental Prestige Electronics

USA . 5,300 parts In-Stock

1+ parts

$0.389

100+ parts

-

1k+ parts

-

10k+ parts

$0.381

5,300

$0.389

-

-

$0.381

Argo Parts USA

USA . 226 parts In-Stock

1+ parts

$0.389

100+ parts

-

1k+ parts

-

10k+ parts

$0.377

226

$0.389

-

-

$0.377

Parana Technologies

USA . 1,930 parts In-Stock

1+ parts

$0.409

100+ parts

-

1k+ parts

$1.591

10k+ parts

-

1,930

$0.409

-

$1.591

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DigiPath Technology Company

USA . 21 parts In-Stock

1+ parts

$0.451

100+ parts

$0.415

1k+ parts

-

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21

$0.451

$0.415

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ChromeModa Solutions

Germany . 3,269 parts In-Stock

1+ parts

$0.460

100+ parts

$0.377

1k+ parts

-

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3,269

$0.460

$0.377

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IDEA Electronic Components Group

UK . 1,532 parts In-Stock

1+ parts

$0.460

100+ parts

-

1k+ parts

$0.414

10k+ parts

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1,532

$0.460

-

$0.414

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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4,000

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the CSD25485F5T P-CHANNEL Power Field Effect Transistor. This single transistor comes equipped with a built-in diode and resistor, making it ideal for switching applications. With a maximum drain current of 5.3 A and a low on-resistance of 0.07 ohm, this FET delivers exceptional performance. Trust in Texas Instruments to provide cutting-edge technology that meets your power management needs effectively. Elevate your projects with the CSD25485F5T and experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL FETs are suitable for low-side switching applications, making this product versatile for various circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor enhance the efficiency and protection of the circuit, reducing the need for external components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in controlling power flow.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy PCB layout and mounting, optimizing space and efficiency.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material, ensuring stable and consistent performance.

Technical Specifications

Power Field Effect Transistors (FET) CSD25485F5T attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

5.3 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

23 pF

JESD-30 Code:

R-XBCC-N3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

31 A

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD25485F5T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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