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CSD22205L

Texas Instruments

CSD22205L by Texas Instruments

CSD22205L by Texas Instruments is a P-CHANNEL FET with 8V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 71A and 0.04 ohm RDS(ON), operating in the temperature range of -55 to 150 °C. This SINGLE transistor with built-in diode and resistor comes in a SQUARE package style, suitable for surface mount assembly.

Median Price

$0.265

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 846 parts In-Stock

1+ parts

$0.148

100+ parts

$0.148

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$0.147

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846

$0.148

$0.148

$0.147

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Texas Instruments

USA . 46,993 parts In-Stock

1+ parts

$0.359

100+ parts

$0.244

1k+ parts

$0.125

10k+ parts

-

46,993

$0.359

$0.244

$0.125

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Mouser Electronics

USA . 3,468 parts In-Stock

1+ parts

$0.840

100+ parts

$0.337

1k+ parts

$0.232

10k+ parts

$0.179

3,468

$0.840

$0.337

$0.232

$0.179

DigiKey

USA . 3,011 parts In-Stock

1+ parts

$0.840

100+ parts

$0.336

1k+ parts

$0.232

10k+ parts

$0.175

3,011

$0.840

$0.336

$0.232

$0.175

Verical

USA . 1,236 parts In-Stock

1+ parts

-

100+ parts

$0.152

1k+ parts

$0.142

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1,236

-

$0.152

$0.142

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Chip1Stop

Japan . 756 parts In-Stock

1+ parts

-

100+ parts

$0.171

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$0.170

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756

-

$0.171

$0.170

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 208 parts In-Stock

1+ parts

$0.141

100+ parts

-

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208

$0.141

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Vyrian

USA . 2,832 parts In-Stock

1+ parts

$0.148

100+ parts

-

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2,832

$0.148

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-

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Maritex

Poland . 100 parts In-Stock

1+ parts

$0.515

100+ parts

$0.332

1k+ parts

$0.286

10k+ parts

-

100

$0.515

$0.332

$0.286

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Chip Stock

USA . 18,491 parts In-Stock

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18,491

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ComSIT Distribution GmbH

Germany . 3,708 parts In-Stock

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3,708

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Corphita

USA . 941 parts In-Stock

1+ parts

$0.133

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941

$0.133

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Native Components

USA . 162 parts In-Stock

1+ parts

$0.498

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162

$0.498

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Northwest PG Solutions

USA . 731 parts In-Stock

1+ parts

$0.548

100+ parts

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10k+ parts

$0.483

731

$0.548

-

-

$0.483

Parana Technologies

USA . 905 parts In-Stock

1+ parts

$1.647

100+ parts

-

1k+ parts

$2.262

10k+ parts

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905

$1.647

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$2.262

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DigiPath Technology Company

USA . 365 parts In-Stock

1+ parts

$1.814

100+ parts

$1.669

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365

$1.814

$1.669

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IDEA Electronic Components Group

UK . 1,179 parts In-Stock

1+ parts

$1.851

100+ parts

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1k+ parts

$1.666

10k+ parts

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1,179

$1.851

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$1.666

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ChromeModa Solutions

Germany . 476 parts In-Stock

1+ parts

$1.851

100+ parts

$1.518

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476

$1.851

$1.518

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Lixinc

USA . 16,981 parts In-Stock

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16,981

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Kepictronics

USA . 1,051 parts In-Stock

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1,051

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GreenTree Electronics

Israel . 610 parts In-Stock

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610

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Overview

Experience the ultimate in power and efficiency with the Texas Instruments CSD22205L Power Field Effect Transistor. Manufactured by industry leader Texas Instruments, this P-Channel transistor offers a single configuration with a built-in diode and resistor, making it ideal for switching applications. With a maximum pulsed drain current of 71 A and a low on-resistance of 0.04 ohm, this transistor provides high performance in a compact square package. Trust Texas Instruments for quality and reliability in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good protection and insulation for the FET, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high current-carrying capability, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Having a built-in diode and resistor simplifies circuit design, reduces component count, and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and fast performance.

Surface Mount: YES

Surface mount package allows for easier and more convenient soldering and installation on modern PCBs.

Minimum DS Breakdown Voltage: 8 V

Minimum breakdown voltage of 8V ensures protection against excessive voltage levels, enhancing the FET's reliability.

Package Shape: SQUARE

Square package shape helps in efficient PCB layout and space utilization.

Terminal Form: BUTT

Butt terminals provide a secure and reliable connection to the PCB, ensuring good electrical contact.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the switching operation and high performance in various applications.

Maximum Pulsed Drain Current (IDM): 71 A

High maximum pulsed drain current allows for handling of large current spikes without damage.

No. of Terminals: 4

Having 4 terminals allows for versatile connections and flexibility in circuit design.

Package Style (Meter): GRID ARRAY

Grid array package style provides good mechanical strength and reliability for the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance, high efficiency, and reliability.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for operation in demanding environments without degradation in performance.

Transistor Element Material: SILICON

Silicon material offers good electrical properties, reliability, and performance for the FET.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in cold environments without performance issues.

Terminal Finish: NICKEL GOLD

Nickel gold terminal finish provides good conductivity, corrosion resistance, and solderability.

Maximum Drain Current (ID): 7.4 A

High maximum drain current rating ensures the FET can handle substantial continuous current.

Maximum Drain-Source On Resistance: 0.04 ohm

Low on-resistance ensures minimal power loss and high efficiency in switching applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and soldering.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering without damaging the FET.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and proper PCB assembly.

Maximum Feedback Capacitance (Crss): 250 pF

Low feedback capacitance helps in reducing switching losses and improving high-frequency performance.

Technical Specifications

Power Field Effect Transistors (FET) CSD22205L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (ID):

7.4 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

250 pF

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

71 A

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD22205L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.40

SB

8541.21.00.40

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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