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CSD25404Q3

Texas Instruments

CSD25404Q3 by Texas Instruments

CSD25404Q3 by Texas Instruments is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 240A IDM, and 0.0121 ohm Drain-Source On Resistance. With an operating temperature range of -55 to 150 °C, it is ideal for high-power switching circuits in various electronic devices.

Median Price

$0.630

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,369 parts In-Stock

1+ parts

$0.746

100+ parts

$0.574

1k+ parts

$0.302

10k+ parts

-

15,369

$0.746

$0.574

$0.302

-

DigiKey

USA . 7,435 parts In-Stock

1+ parts

$1.580

100+ parts

$0.665

1k+ parts

$0.477

10k+ parts

$0.381

7,435

$1.580

$0.665

$0.477

$0.381

Mouser Electronics

USA . 1,914 parts In-Stock

1+ parts

$1.580

100+ parts

$0.663

1k+ parts

$0.476

10k+ parts

$0.432

1,914

$1.580

$0.663

$0.476

$0.432

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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$0.378

2,500

-

-

-

$0.378

Chip1Stop

Japan . 743 parts In-Stock

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743

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Verical

USA . 289 parts In-Stock

1+ parts

-

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$0.377

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$0.292

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289

-

$0.377

$0.292

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Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$0.513

1k+ parts

$0.425

10k+ parts

$0.379

20

-

$0.513

$0.425

$0.379

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 239 parts In-Stock

1+ parts

$0.398

100+ parts

-

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-

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239

$0.398

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.509

100+ parts

-

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-

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10

$0.509

-

-

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Vyrian

USA . 4,196 parts In-Stock

1+ parts

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4,196

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TME

Poland . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

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$0.559

2,500

-

-

-

$0.559

ComSIT Distribution GmbH

Germany . 20 parts In-Stock

1+ parts

-

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20

-

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Distributors (Availability)

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Semicontronic

India . 4,021 parts In-Stock

1+ parts

$0.354

100+ parts

$0.345

1k+ parts

$0.343

10k+ parts

-

4,021

$0.354

$0.345

$0.343

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Ampacity Inc.

Singapore . 3,874 parts In-Stock

1+ parts

$0.354

100+ parts

-

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3,874

$0.354

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Corphita

USA . 962 parts In-Stock

1+ parts

$0.377

100+ parts

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962

$0.377

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Corohmni

South Africa . 54 parts In-Stock

1+ parts

$0.378

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54

$0.378

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Parana Technologies

USA . 1,426 parts In-Stock

1+ parts

$0.409

100+ parts

-

1k+ parts

$1.591

10k+ parts

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1,426

$0.409

-

$1.591

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DigiPath Technology Company

USA . 919 parts In-Stock

1+ parts

$0.450

100+ parts

$0.414

1k+ parts

-

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919

$0.450

$0.414

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ChromeModa Solutions

Germany . 3,221 parts In-Stock

1+ parts

$0.459

100+ parts

$0.376

1k+ parts

-

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3,221

$0.459

$0.376

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IDEA Electronic Components Group

UK . 1,124 parts In-Stock

1+ parts

$0.459

100+ parts

-

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$0.413

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1,124

$0.459

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$0.413

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Continental Prestige Electronics

USA . 5,585 parts In-Stock

1+ parts

$0.495

100+ parts

-

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$0.485

5,585

$0.495

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$0.485

Argo Parts USA

USA . 3,038 parts In-Stock

1+ parts

$0.495

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-

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$0.480

3,038

$0.495

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$0.480

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.509

100+ parts

$0.499

1k+ parts

-

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100

$0.509

$0.499

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.077

100+ parts

$1.024

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$1.024

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1,000

$1.077

$1.024

$1.024

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Lixinc

USA . 15,701 parts In-Stock

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15,701

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A-Z Elektronik GmbH

Germany . 12,764 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,929 parts In-Stock

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1,929

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Perfect Parts

USA . 1,277 parts In-Stock

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1,277

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Futuretech Components

Singapore . 681 parts In-Stock

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681

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Formix International (Excess)

India . 67 parts In-Stock

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67

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Overview

Looking for a reliable power solution? Look no further than the CSD25404Q3 by Texas Instruments. As a leader in semiconductor technology, Texas Instruments delivers top-quality products that meet the highest standards. The CSD25404Q3 is a P-channel power field-effect transistor perfect for switching applications. With a high pulsing drain current and low on-resistance, this transistor offers superior performance and efficiency. Trust Texas Instruments to provide cutting-edge technology that meets your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY -

The plastic/epoxy material used for the package body makes this FET durable and resistant to damage.

Polarity or Channel Type: P-CHANNEL -

The P-channel type of polarity makes this FET suitable for specific applications where this type of channel is required.

Configuration: SINGLE -

The single configuration of this FET simplifies the circuit design and reduces complexity.

Transistor Application: SWITCHING -

Designed for switching applications, this FET ensures efficient and reliable performance in such scenarios.

Surface Mount: YES -

Being surface mountable, this FET is easy to install and saves space on the PCB.

Minimum DS Breakdown Voltage: 20 V -

With a minimum breakdown voltage of 20V, this FET can handle higher voltages without failure.

Package Shape: SQUARE -

The square package shape provides a compact and efficient design for easy integration into circuits.

Terminal Form: NO LEAD -

The no-lead terminal form of this FET simplifies soldering and improves reliability.

Operating Mode: ENHANCEMENT MODE -

Operating in enhancement mode allows for better control over the FET's performance.

Maximum Pulsed Drain Current (IDM): 240 A -

With a maximum pulsed drain current of 240A, this FET can handle high current loads effectively.

No. of Terminals: 8 -

With 8 terminals, this FET offers versatility and flexibility in circuit connections.

Package Style (Meter): SMALL OUTLINE -

The small outline package style ensures a space-saving design for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR -

Utilizing metal-oxide semiconductor technology, this FET offers enhanced performance and reliability.

Maximum Operating Temperature: 150 °C -

With a maximum operating temperature of 150°C, this FET can withstand high-temperature environments.

Transistor Element Material: SILICON -

The silicon transistor element material provides excellent conductivity and reliability.

Minimum Operating Temperature: -55 °C -

With a minimum operating temperature of -55°C, this FET is suitable for a wide range of environments and applications.

Terminal Finish: MATTE TIN -

The matte tin terminal finish enhances solderability and improves the FET's overall performance.

Maximum Drain Current (ID): 18 A -

The maximum drain current of 18A ensures efficient power handling capabilities.

Maximum Drain-Source On Resistance: 0.0121 ohm -

The low drain-source on resistance of 0.0121 ohm reduces power losses and improves efficiency.

Terminal Position: DUAL -

The dual terminal position offers flexibility in circuit connections and layout.

Case Connection: SOURCE -

The source case connection simplifies the circuit design and improves performance.

Maximum Time At Peak Reflow Temperature (s): 30 -

With a maximum reflow time of 30s, this FET can withstand the reflow process without damage.

Peak Reflow Temperature °C: 260 -

The peak reflow temperature of 260°C ensures proper soldering and durability.

Maximum Feedback Capacitance (Crss): 68 pF -

The maximum feedback capacitance of 68pF ensures stable and controlled operation of the FET.

Technical Specifications

Power Field Effect Transistors (FET) CSD25404Q3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.0121 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

68 pF

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

240 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD25404Q3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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