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CSD19538Q3A

Texas Instruments

CSD19538Q3A by Texas Instruments

CSD19538Q3A by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. It features a 100V DS Breakdown Voltage, 37A Pulsed Drain Current, and 0.072 ohm Drain-Source On Resistance. This ENHANCEMENT MODE transistor operates b/w -55 to 150 °C and comes in a SMALL OUTLINE package with METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$0.386

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 890 parts In-Stock

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$0.346

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$0.266

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$0.346

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Texas Instruments

USA . 514,435 parts In-Stock

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$0.294

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$0.151

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DigiKey

USA . 4,495 parts In-Stock

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$1.030

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$0.418

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$0.291

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$1.030

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RS (Exports)

UK . 1,975 parts In-Stock

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$0.409

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Verical

USA . 900 parts In-Stock

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$0.363

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Chip1Stop

Japan . 175 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.279

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10

$0.279

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Digiode

USA . 486 parts In-Stock

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$0.329

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Vyrian

USA . 78,301 parts In-Stock

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Chip Stock

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ComSIT Distribution GmbH

Germany . 8,435 parts In-Stock

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ComSIT USA

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SIE Connect GmbH - GreenChips

Germany . 5,896 parts In-Stock

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Sensible Micro Corp

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Cyclops Electronics Ltd

UK . 3,835 parts In-Stock

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Greenchips

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Ampacity Inc.

Singapore . 78,232 parts In-Stock

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$0.181

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$0.181

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Semicontronic

India . 78,050 parts In-Stock

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$0.181

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$0.176

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$0.176

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Continental Prestige Electronics

USA . 5,735 parts In-Stock

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$0.279

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$0.273

5,735

$0.279

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$0.273

Argo Parts USA

USA . 4,081 parts In-Stock

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$0.279

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$0.271

4,081

$0.279

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$0.271

Corphita

USA . 76 parts In-Stock

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$0.311

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Corohmni

South Africa . 278 parts In-Stock

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$0.600

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Parana Technologies

USA . 838 parts In-Stock

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$1.206

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$2.001

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$1.206

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$2.001

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DigiPath Technology Company

USA . 845 parts In-Stock

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$1.328

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$1.222

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845

$1.328

$1.222

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ChromeModa Solutions

Germany . 1,917 parts In-Stock

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$1.355

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$1.111

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IDEA Electronic Components Group

UK . 1,296 parts In-Stock

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$1.355

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$1.220

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$1.996

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$1.896

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$1.896

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$1.996

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Perfect Parts

USA . 944,290 parts In-Stock

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GreenTree Electronics

Israel . 100,000 parts In-Stock

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Epart123

USA . 25,000 parts In-Stock

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Metaverse IC Inc.

Canada . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Infinite Electronics LLP (Excess)

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A-Z Elektronik GmbH

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Legend Electronics Inc. (Excess)

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iodParts Technologies Inc.

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Authorized Procurement Solutions

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Allen Electronics Distributors

USA . 2,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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ChipstoGo Electronic ltd

UK . 645 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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Formix International (Excess)

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Lixinc

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Overview

Elevate your power management solutions with the CSD19538Q3A by Texas Instruments. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Texas Instruments delivers top-notch quality and reliability. Ideal for switching applications, this N-CHANNEL transistor offers enhanced performance with a maximum pulsed drain current of 37A and a low on-resistance of 0.072 ohm. From its wide operating temperature range to its compact package style, the CSD19538Q3A provides unmatched value and efficiency for all your power needs. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the product durable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance, higher current handling capacity, and faster switching speed, making them suitable for many applications.

Configuration: SINGLE

SINGLE configuration allows for easy integration into various circuit designs.

Transistor Application: SWITCHING

Designed for switching applications, ensuring efficient control over power flow.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB design.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages safely.

Maximum Pulsed Drain Current (IDM): 37 A

Capable of handling high pulsed current loads, suitable for power applications.

Avalanche Energy Rating (EAS): 8.1 mJ

Avalanche energy rating indicates the ability to withstand voltage spikes, making it robust in harsh conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate reliably in elevated temperature environments.

Maximum Drain Current (ID): 4.9 A

Capable of handling continuous current flows, suitable for various applications.

Maximum Drain-Source On Resistance: 0.072 ohm

Low ON resistance results in minimal power loss and efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) CSD19538Q3A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

8.1 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

4.9 A

Maximum Drain-Source On Resistance:

.072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

16.4 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

37 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19538Q3A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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