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CSD19535KCS

Texas Instruments

CSD19535KCS by Texas Instruments

CSD19535KCS by Texas Instruments is a N-CHANNEL FET with 100V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 400A IDM and 0.0044 ohm RDS(on). Operating from -55 to 175 °C, this transistor has a built-in diode and 38pF Crss.

Median Price

$3.218

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 320 parts In-Stock

1+ parts

$2.167

100+ parts

$1.899

1k+ parts

$1.073

10k+ parts

-

320

$2.167

$1.899

$1.073

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Mouser Electronics

USA . 660 parts In-Stock

1+ parts

$4.270

100+ parts

$2.020

1k+ parts

$1.650

10k+ parts

$1.530

660

$4.270

$2.020

$1.650

$1.530

DigiKey

USA . 3,657 parts In-Stock

1+ parts

$4.860

100+ parts

$2.276

1k+ parts

$1.748

10k+ parts

$1.610

3,657

$4.860

$2.276

$1.748

$1.610

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$1.674

1k+ parts

$1.408

10k+ parts

$1.388

250

-

$1.674

$1.408

$1.388

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$1.821

100+ parts

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45

$1.821

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Digiode

USA . 3,482 parts In-Stock

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$2.059

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3,482

$2.059

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TME

Poland . 429 parts In-Stock

1+ parts

$4.210

100+ parts

$2.180

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-

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429

$4.210

$2.180

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Chip Stock

USA . 4,270 parts In-Stock

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4,270

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Vyrian

USA . 4,132 parts In-Stock

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4,132

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Speed Components Ltd

Israel . 10 parts In-Stock

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10

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Cyclops Electronics Ltd

UK . 6 parts In-Stock

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6

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LWI Electronics Inc

India . 2 parts In-Stock

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Elcom Components

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,276 parts In-Stock

1+ parts

$0.581

100+ parts

-

1k+ parts

$1.670

10k+ parts

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2,276

$0.581

-

$1.670

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DigiPath Technology Company

USA . 2,120 parts In-Stock

1+ parts

$0.640

100+ parts

$0.589

1k+ parts

-

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2,120

$0.640

$0.589

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ChromeModa Solutions

Germany . 2,900 parts In-Stock

1+ parts

$0.653

100+ parts

$0.535

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-

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2,900

$0.653

$0.535

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IDEA Electronic Components Group

UK . 1,609 parts In-Stock

1+ parts

$0.653

100+ parts

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1k+ parts

$0.588

10k+ parts

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1,609

$0.653

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$0.588

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Ampacity Inc.

Singapore . 157 parts In-Stock

1+ parts

$1.420

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157

$1.420

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Semicontronic

India . 85 parts In-Stock

1+ parts

$1.420

100+ parts

$1.384

1k+ parts

$1.377

10k+ parts

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85

$1.420

$1.384

$1.377

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Continental Prestige Electronics

USA . 4,809 parts In-Stock

1+ parts

$1.821

100+ parts

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$1.785

4,809

$1.821

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$1.785

Argo Parts USA

USA . 4,161 parts In-Stock

1+ parts

$1.821

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4,161

$1.821

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Corphita

USA . 2,026 parts In-Stock

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$1.950

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2,026

$1.950

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Corohmni

South Africa . 288 parts In-Stock

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$1.982

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$1.982

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Component Stockers USA

USA . 69,334 parts In-Stock

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$2.000

100+ parts

$1.900

1k+ parts

$1.250

10k+ parts

$1.250

69,334

$2.000

$1.900

$1.250

$1.250

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Experience the superior quality and reliability of Texas Instruments with the CSD19535KCS Power Field Effect Transistor. Ideal for switching applications, this N-CHANNEL transistor offers a single configuration with a built-in diode, ensuring efficient performance. With a maximum drain current of 150A and a low on-resistance of 0.0044 ohm, this transistor provides exceptional value and benefits to customers looking for high-performance components. Trust Texas Instruments for your power management needs and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer high efficiency and lower resistance, making them ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the performance and efficiency of the transistor, making it a versatile option for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching operations, this FET offers fast switching speeds and high efficiency.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle high voltage loads safely and efficiently.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation of the transistor in various systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring stability in circuit applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer low power consumption and fast response times, making them a practical choice for many applications.

Maximum Pulsed Drain Current (IDM): 400 A

With a high pulsed drain current rating, this FET can handle sudden surges of power without damage.

Avalanche Energy Rating (EAS): 451 mJ

The high avalanche energy rating makes this FET suitable for applications where energy spikes and surges are common.

No. of Terminals: 3

The three terminals provide flexibility and ease of use in circuit design and implementation.

Package Style (Meter): FLANGE MOUNT

The flange mount style allows for secure mounting and heat dissipation in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, making this transistor an efficient choice.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand heat and operate reliably in demanding environments.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making them a popular choice for various applications.

Minimum Operating Temperature: -55 °C

The low operating temperature range allows this FET to function effectively in cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures reliable connections for the transistor.

Maximum Drain Current (ID): 150 A

With a high drain current rating, this FET can handle substantial power loads without overheating or damage.

Maximum Drain-Source On Resistance: 0.0044 ohm

The low on-resistance of this FET results in minimal power loss and efficient operation in various applications.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and ensures proper alignment in circuit designs.

Case Connection: DRAIN

The drain connection allows for easy integration into circuit layouts and provides efficient current flow.

Maximum Feedback Capacitance (Crss): 38 pF

The low feedback capacitance of this FET minimizes signal distortion and interference, ensuring accurate operation in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD19535KCS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

451 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

150 A

Maximum Drain-Source On Resistance:

.0044 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

38 pF

JEDEC-95 Code:

TO-220

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19535KCS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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