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CSD18535KTT

Texas Instruments

CSD18535KTT by Texas Instruments

CSD18535KTT by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. It has a 60V DS Breakdown Voltage, 400A IDM, and 0.0029 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, it can handle up to 175°C temperature making it suitable for high-power electronic devices.

Median Price

$3.870

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,301 parts In-Stock

1+ parts

$2.176

100+ parts

$1.906

1k+ parts

$1.077

10k+ parts

-

11,301

$2.176

$1.906

$1.077

-

Chip1Stop

Japan . 370 parts In-Stock

1+ parts

$3.590

100+ parts

-

1k+ parts

-

10k+ parts

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370

$3.590

-

-

-

Mouser Electronics

USA . 639 parts In-Stock

1+ parts

$4.150

100+ parts

$2.120

1k+ parts

$1.640

10k+ parts

$1.530

639

$4.150

$2.120

$1.640

$1.530

DigiKey

USA . 835 parts In-Stock

1+ parts

$4.260

100+ parts

$1.966

1k+ parts

-

10k+ parts

-

835

$4.260

$1.966

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.770

100+ parts

-

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-

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10

$1.770

-

-

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Digiode

USA . 1,874 parts In-Stock

1+ parts

$2.067

100+ parts

-

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10k+ parts

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1,874

$2.067

-

-

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Vyrian

USA . 6,264 parts In-Stock

1+ parts

-

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-

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10k+ parts

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6,264

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,069 parts In-Stock

1+ parts

$1.652

100+ parts

-

1k+ parts

$2.264

10k+ parts

-

2,069

$1.652

-

$2.264

-

Argo Parts USA

USA . 3,472 parts In-Stock

1+ parts

$1.770

100+ parts

-

1k+ parts

-

10k+ parts

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3,472

$1.770

-

-

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Continental Prestige Electronics

USA . 1,002 parts In-Stock

1+ parts

$1.770

100+ parts

-

1k+ parts

-

10k+ parts

$1.735

1,002

$1.770

-

-

$1.735

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.770

100+ parts

-

1k+ parts

-

10k+ parts

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500

$1.770

-

-

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DigiPath Technology Company

USA . 1,534 parts In-Stock

1+ parts

$1.819

100+ parts

$1.673

1k+ parts

-

10k+ parts

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1,534

$1.819

$1.673

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Ampacity Inc.

Singapore . 2,921 parts In-Stock

1+ parts

$1.850

100+ parts

-

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2,921

$1.850

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Semicontronic

India . 2,845 parts In-Stock

1+ parts

$1.850

100+ parts

$1.804

1k+ parts

$1.794

10k+ parts

-

2,845

$1.850

$1.804

$1.794

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ChromeModa Solutions

Germany . 3,578 parts In-Stock

1+ parts

$1.856

100+ parts

$1.522

1k+ parts

-

10k+ parts

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3,578

$1.856

$1.522

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IDEA Electronic Components Group

UK . 705 parts In-Stock

1+ parts

$1.856

100+ parts

-

1k+ parts

$1.670

10k+ parts

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705

$1.856

-

$1.670

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Corphita

USA . 2,309 parts In-Stock

1+ parts

$1.958

100+ parts

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2,309

$1.958

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Perfect Parts

USA . 12,880 parts In-Stock

1+ parts

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12,880

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Lixinc

USA . 3,891 parts In-Stock

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3,891

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Overview

Looking to enhance your electronic devices with top-quality components? Look no further than the Texas Instruments CSD18535KTT Power Field Effect Transistor. With a reputation for excellence in manufacturing, Texas Instruments delivers reliable products that guarantee superior performance. This N-CHANNEL switching transistor is ideal for a variety of applications and offers enhanced efficiency and reliability. Upgrade your devices today with the CSD18535KTT and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers better efficiency and performance compared to P-channel FETs, making it ideal for various applications.

Configuration: SINGLE

Simplified design and easier integration into circuits for a more straightforward setup.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in on/off scenarios.

Surface Mount: YES

Facilitates easier installation onto circuit boards, saving time and effort during manufacturing.

Minimum DS Breakdown Voltage: 60 V

Can handle higher voltage levels, providing more robust protection for the circuit.

Terminal Form: GULL WING

Allows for easy soldering onto the circuit board, ensuring a secure connection.

Maximum Pulsed Drain Current (IDM): 400 A

Capable of handling high current loads during peak operation, making it suitable for power-intensive applications.

Avalanche Energy Rating (EAS): 616 mJ

Can withstand sudden high-energy spikes without damaging the FET, ensuring reliability in challenging conditions.

No. of Terminals: 3

Simple and straightforward connection setup for ease of integration into circuits.

Package Style (Meter): SMALL OUTLINE

Compact size allows for space-saving installation in tight layouts, ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers efficient power management with minimal energy loss, ensuring high performance and low heat generation.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without compromising performance, suitable for a wide range of applications.

Transistor Element Material: SILICON

Provides excellent conductivity and reliability, ensuring consistent performance over the FET's lifespan.

Minimum Operating Temperature: -55 °C

Capable of operating in cold temperatures, making it suitable for a variety of environmental conditions.

Terminal Finish: MATTE TIN

Provides corrosion resistance and solderability for a reliable electrical connection.

Maximum Drain Current (ID): 200 A

High current capacity for demanding applications, ensuring efficient power delivery.

Maximum Drain-Source On Resistance: 0.0029 ohm

Low resistance for efficient power transfer, minimizing heat generation and energy loss.

Terminal Position: SINGLE

Simplified connection setup for easier integration into circuits.

Moisture Sensitivity Level (MSL): 2

Resistant to moisture damage, ensuring reliability in humid environments.

Case Connection: DRAIN

Clear labeling and connection point for easier installation and troubleshooting.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for precise soldering without damaging the FET, ensuring proper functionality.

Peak Reflow Temperature °C: 260

High reflow temperature capability for reliable soldering and connection.

Maximum Feedback Capacitance (Crss): 31 pF

Low feedback capacitance for improved stability and performance in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD18535KTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

616 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

31 pF

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD18535KTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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