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CSD18503Q5AT

Texas Instruments

CSD18503Q5AT by Texas Instruments

CSD18503Q5AT by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. Features include 40V DS Breakdown Voltage, 321A IDM, and 0.0062 ohm Drain-Source Resistance. Ideal for high-power switching circuits in various electronic devices.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 68,076 parts In-Stock

1+ parts

$1.236

100+ parts

$1.021

1k+ parts

$0.552

10k+ parts

-

68,076

$1.236

$1.021

$0.552

-

Mouser Electronics

USA . 395 parts In-Stock

1+ parts

$2.700

100+ parts

$1.060

1k+ parts

$0.908

10k+ parts

-

395

$2.700

$1.060

$0.908

-

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.983

10k+ parts

$0.865

500

-

-

$0.983

$0.865

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.682

10k+ parts

$0.656

250

-

-

$0.682

$0.656

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.840

100+ parts

-

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150

$0.840

-

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Digiode

USA . 4,378 parts In-Stock

1+ parts

$1.174

100+ parts

-

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-

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4,378

$1.174

-

-

-

TME

Poland . 88 parts In-Stock

1+ parts

$2.500

100+ parts

$1.070

1k+ parts

$0.790

10k+ parts

-

88

$2.500

$1.070

$0.790

-

Chip Stock

USA . 19,200 parts In-Stock

1+ parts

-

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19,200

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Vyrian

USA . 6,848 parts In-Stock

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6,848

-

-

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Extreme Components

USA . 1,250 parts In-Stock

1+ parts

-

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1,250

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-

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ComSIT Distribution GmbH

Germany . 26 parts In-Stock

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26

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ComSIT USA

USA . 26 parts In-Stock

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26

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,895 parts In-Stock

1+ parts

$0.840

100+ parts

-

1k+ parts

-

10k+ parts

-

2,895

$0.840

-

-

-

Continental Prestige Electronics

USA . 525 parts In-Stock

1+ parts

$0.840

100+ parts

-

1k+ parts

-

10k+ parts

$0.823

525

$0.840

-

-

$0.823

Ampacity Inc.

Singapore . 22,763 parts In-Stock

1+ parts

$0.930

100+ parts

-

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22,763

$0.930

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Corphita

USA . 1,166 parts In-Stock

1+ parts

$1.112

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1,166

$1.112

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Parana Technologies

USA . 1,964 parts In-Stock

1+ parts

$1.444

100+ parts

-

1k+ parts

$2.135

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1,964

$1.444

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$2.135

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DigiPath Technology Company

USA . 1,940 parts In-Stock

1+ parts

$1.591

100+ parts

$1.463

1k+ parts

-

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1,940

$1.591

$1.463

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ChromeModa Solutions

Germany . 3,893 parts In-Stock

1+ parts

$1.623

100+ parts

$1.331

1k+ parts

-

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3,893

$1.623

$1.331

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IDEA Electronic Components Group

UK . 613 parts In-Stock

1+ parts

$1.623

100+ parts

-

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$1.461

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613

$1.623

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$1.461

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QUARKTWIN TECHNOLOGY LTD

USA . 15,253 parts In-Stock

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15,253

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A-Z Elektronik GmbH

Germany . 7,894 parts In-Stock

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7,894

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Alle Elektronik GmbH

Germany . 3,596 parts In-Stock

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3,596

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Lixinc

USA . 1,569 parts In-Stock

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1,569

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.823

1k+ parts

$0.798

10k+ parts

$0.781

1,000

-

$0.823

$0.798

$0.781

Kepictronics

USA . 483 parts In-Stock

1+ parts

-

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483

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Overview

Experience superior performance and reliability with the CSD18503Q5AT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality power field effect transistors that excel in switching applications. With an N-channel configuration and built-in diode, this transistor offers enhanced functionality and efficiency. Whether you're looking to optimize your power management system or enhance your electronic devices, the CSD18503Q5AT provides unmatched value and benefits. Trust Texas Instruments for cutting-edge technology and innovation that meets your needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection, making it suitable for various applications.

Polarity or Channel Type:

N-CHANNEL - Offers efficient performance and control in switching applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and enhances functionality.

Transistor Application:

SWITCHING - Ensures fast and reliable switching performance in various electronic devices.

Surface Mount:

YES - Allows for easy integration onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage:

40 V - Provides reliable protection against voltage spikes and surges.

Package Shape:

RECTANGULAR - Facilitates easy placement and mounting within electronic systems.

Terminal Form:

NO LEAD - Ensures a compact and lightweight design for enhanced portability.

Operating Mode:

ENHANCEMENT MODE - Enables precise control and efficient operation in a variety of applications.

Maximum Pulsed Drain Current (IDM):

321 A - Handles high currents for heavy-duty applications with ease.

Avalanche Energy Rating (EAS):

157 mJ - Offers robust protection against avalanche breakdown events.

No. of Terminals:

8 - Provides flexibility for connecting to external components and circuits.

Package Style (Meter):

SMALL OUTLINE - Ideal for applications where space is limited but performance is crucial.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Ensures high efficiency and reliability in operation.

Maximum Operating Temperature:

150 °C - Suitable for use in a wide range of temperature conditions.

Transistor Element Material:

SILICON - Provides excellent conductivity and reliability in various electronic applications.

Minimum Operating Temperature:

55 °C - Capable of operating in extreme cold environments without compromising performance.

Terminal Finish:

MATTE TIN - Ensures secure and reliable connections for long-lasting performance.

Maximum Drain Current (ID):

19 A - Handles high currents efficiently for demanding applications.

Maximum Drain-Source On Resistance:

0.0062 ohm - Provides low resistance for improved efficiency and reduced power loss.

Terminal Position:

DUAL - Enables versatile installation options to suit different circuit layouts.

Case Connection:

DRAIN - Ensures proper grounding and efficient heat dissipation for reliable operation.

Maximum Time At Peak Reflow Temperature (s):

30 - Allows for safe and effective soldering processes during assembly.

Peak Reflow Temperature °C:

260 - Ensures proper bonding of components for reliable performance under various conditions.

Maximum Feedback Capacitance (Crss):

16 pF - Helps minimize signal distortion and interference for improved overall performance.

Technical Specifications

Power Field Effect Transistors (FET) CSD18503Q5AT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

157 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.0062 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

16 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

321 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD18503Q5AT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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