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CSD16321Q5T

Texas Instruments

CSD16321Q5T by Texas Instruments

CSD16321Q5T by Texas Instruments is an N-CHANNEL Power FET with 25V DS Breakdown Voltage and 0.0038 ohm Drain-Source On Resistance. Ideal for SWITCHING applications, it features a max IDM of 400A and EAS of 218mJ. This SINGLE transistor in PLASTIC/EPOXY package operates b/w -55 to 150 °C, making it suitable for various power management needs.

Median Price

$2.010

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 405 parts In-Stock

1+ parts

$1.561

100+ parts

$1.289

1k+ parts

$0.697

10k+ parts

-

405

$1.561

$1.289

$0.697

-

Mouser Electronics

USA . 274 parts In-Stock

1+ parts

$2.010

100+ parts

$1.110

1k+ parts

$1.060

10k+ parts

-

274

$2.010

$1.110

$1.060

-

DigiKey

USA . 186 parts In-Stock

1+ parts

$2.010

100+ parts

$1.206

1k+ parts

$1.074

10k+ parts

$0.997

186

$2.010

$1.206

$1.074

$0.997

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,592 parts In-Stock

1+ parts

$1.483

100+ parts

-

1k+ parts

-

10k+ parts

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4,592

$1.483

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-

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Vyrian

USA . 7,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,137

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,654 parts In-Stock

1+ parts

$0.709

100+ parts

-

1k+ parts

$1.740

10k+ parts

-

1,654

$0.709

-

$1.740

-

DigiPath Technology Company

USA . 1,860 parts In-Stock

1+ parts

$0.781

100+ parts

$0.719

1k+ parts

-

10k+ parts

-

1,860

$0.781

$0.719

-

-

ChromeModa Solutions

Germany . 6,382 parts In-Stock

1+ parts

$0.797

100+ parts

$0.654

1k+ parts

-

10k+ parts

-

6,382

$0.797

$0.654

-

-

IDEA Electronic Components Group

UK . 717 parts In-Stock

1+ parts

$0.797

100+ parts

-

1k+ parts

$0.717

10k+ parts

-

717

$0.797

-

$0.717

-

Ampacity Inc.

Singapore . 72 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

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72

$1.330

-

-

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Corphita

USA . 2,949 parts In-Stock

1+ parts

$1.405

100+ parts

-

1k+ parts

-

10k+ parts

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2,949

$1.405

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-

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Corohmni

South Africa . 299 parts In-Stock

1+ parts

$1.561

100+ parts

-

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-

10k+ parts

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299

$1.561

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-

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Native Components

USA . 730 parts In-Stock

1+ parts

$1.994

100+ parts

-

1k+ parts

-

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730

$1.994

-

-

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Northwest PG Solutions

USA . 2,300 parts In-Stock

1+ parts

$2.193

100+ parts

-

1k+ parts

-

10k+ parts

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2,300

$2.193

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-

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Semicontronic

India . 270 parts In-Stock

1+ parts

$2.890

100+ parts

$2.818

1k+ parts

$2.803

10k+ parts

-

270

$2.890

$2.818

$2.803

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Overview

Experience the superior performance and reliability of the CSD16321Q5T by Texas Instruments, a top-quality N-CHANNEL Power Field Effect Transistor with a built-in diode. Ideal for switching applications, this transistor offers enhanced efficiency and precision in a compact package. With a maximum pulsed drain current of 400A and a low on-resistance, this product delivers exceptional power dissipation capabilities. Trust Texas Instruments for cutting-edge technology and unmatched durability in every application. Elevate your projects with the CSD16321Q5T and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Transistor Application: SWITCHING

Designed for switching applications, providing efficient and fast switching capabilities.

Surface Mount: YES

Enables easy and efficient PCB assembly, reducing overall production time and cost.

Maximum Drain-Source On Resistance: 0.0038 ohm

Low ON resistance results in minimal power loss and improved efficiency in high-current applications.

Maximum Power Dissipation (Abs): 113 W

Can handle high power dissipation, making it suitable for applications requiring high current and voltage ratings.

Maximum Operating Temperature: 150 °C

Can operate effectively in high-temperature environments, increasing the versatility of the product.

Maximum Pulsed Drain Current (IDM): 400 A

Capable of handling high peak current levels, ideal for applications requiring short bursts of high current.

Technical Specifications

Power Field Effect Transistors (FET) CSD16321Q5T attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

218 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

150 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD16321Q5T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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