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CLVTH16501IDGGREP

Texas Instruments

CLVTH16501IDGGREP by Texas Instruments

CLVTH16501IDGGREP by Texas Instruments is an 18-bit bus driver with 5.7ns propagation delay, operating at -40 to 85°C. It features a small outline package with dual terminals and true output polarity, suitable for industrial applications requiring high-speed signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,828 parts In-Stock

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Digiode

USA . 1,116 parts In-Stock

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1,116

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Distributors (Availability)

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Native Components

USA . 527 parts In-Stock

1+ parts

$0.667

100+ parts

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527

$0.667

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Northwest PG Solutions

USA . 1,658 parts In-Stock

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$0.734

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1,658

$0.734

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Andel Nordic

Denmark . 5,405 parts In-Stock

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$10.477

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-

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$10.058

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$10.058

5,405

$10.477

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$10.058

$10.058

Parana Technologies

USA . 5 parts In-Stock

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$15.320

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-

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$15.713

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5

$15.320

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$15.713

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AZTECH Wire

Italy . 730 parts In-Stock

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$15.710

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730

$15.710

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One Stop Electronics

USA . 227 parts In-Stock

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$17.000

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227

$17.000

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ChromeModa Solutions

Germany . 2,050 parts In-Stock

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$17.213

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$14.115

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$17.213

$14.115

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IDEA Electronic Components Group

UK . 1,354 parts In-Stock

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$17.213

100+ parts

$16.352

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$15.492

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1,354

$17.213

$16.352

$15.492

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Component Stockers USA

USA . 537 parts In-Stock

1+ parts

$99.990

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537

$99.990

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Corphita

USA . 551 parts In-Stock

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Microchip USA

USA . 188 parts In-Stock

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DigiPath Technology Company

USA . 140 parts In-Stock

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$15.519

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140

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$15.519

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Overview

Enhance your electronic designs with the CLVTH16501IDGGREP by Texas Instruments. As a trusted manufacturer in the industry of Bus Drivers & Transceivers, Texas Instruments delivers high-quality products that stand out in performance and reliability. This versatile 18-bit driver offers a wide range of applications while providing customers with seamless operation and efficient signal transmission. Elevate your projects with the value and benefits that this product brings, ensuring optimal functionality and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources.

Propagation Delay (tpd): 5.7 ns

The low propagation delay of 5.7 ns enables fast and efficient signal transmission, improving overall system performance.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the product can withstand harsh environmental conditions, making it suitable for industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures reliable contact and long-term stability for the product.

Width: 6.1 mm

The compact width of 6.1 mm saves space on the circuit board, making it suitable for applications where board real estate is limited.

Technology: BICMOS

The BICMOS technology used in the product combines the benefits of both bipolar and CMOS technologies, providing high speed and low power consumption.

Technical Specifications

Bus Driver & Transceivers CLVTH16501IDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

CLVTH16501IDGGREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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