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CLVCH16652AIDGGREP

Texas Instruments

CLVCH16652AIDGGREP by Texas Instruments

The Texas Instruments CLVCH16652AIDGGREP is an 8-bit bus driver with a propagation delay of 7.3 ns, suitable for industrial applications. It operates at a supply voltage range of 1.65V to 3.6V and has a temperature range of -40°C to 85°C, making it ideal for various electronic systems requiring fast signal transmission in harsh environments. The package style is small outline, thin profile, shrink pitch with dual terminal position and nickel palladium gold finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,327 parts In-Stock

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3,327

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Digiode

USA . 3,213 parts In-Stock

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3,213

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Distributors (Availability)

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Native Components

USA . 501 parts In-Stock

1+ parts

$0.052

100+ parts

-

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$0.050

501

$0.052

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$0.050

Andel Nordic

Denmark . 428 parts In-Stock

1+ parts

$2.537

100+ parts

-

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$2.435

10k+ parts

$2.435

428

$2.537

-

$2.435

$2.435

Parana Technologies

USA . 1,437 parts In-Stock

1+ parts

$11.704

100+ parts

$1,086.848

1k+ parts

$10.533

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-

1,437

$11.704

$1,086.848

$10.533

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DigiPath Technology Company

USA . 1,415 parts In-Stock

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$12.887

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1,415

$12.887

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ChromeModa Solutions

Germany . 5,844 parts In-Stock

1+ parts

$13.150

100+ parts

$10.783

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5,844

$13.150

$10.783

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IDEA Electronic Components Group

UK . 1,698 parts In-Stock

1+ parts

$13.150

100+ parts

$12.492

1k+ parts

$11.835

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1,698

$13.150

$12.492

$11.835

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AZTECH Wire

Italy . 801 parts In-Stock

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$17.971

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801

$17.971

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One Stop Electronics

USA . 885 parts In-Stock

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$49.000

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885

$49.000

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Component Stockers USA

USA . 462 parts In-Stock

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$99.990

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462

$99.990

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 3,721 parts In-Stock

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Northwest PG Solutions

USA . 345 parts In-Stock

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345

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Microchip USA

USA . 197 parts In-Stock

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197

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Overview

Elevate your electronics with the CLVCH16652AIDGGREP by Texas Instruments, a cutting-edge Bus Driver & Transceiver that guarantees superior quality and reliability. Manufactured by industry leader Texas Instruments, this product offers unparalleled performance in a wide range of applications. With its advanced technology and innovative design, this product provides customers with unmatched value, benefits, and advantages. Upgrade your projects with the CLVCH16652AIDGGREP and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product resistant to damage and wear over time.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one device reduces the need for additional components, simplifying the design and saving costs.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps in minimizing power consumption and increasing efficiency.

Propagation Delay (tpd): 7.3 ns

Low propagation delay ensures fast and reliable data transmission, making the product suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures the product can withstand harsh environmental conditions and operate reliably in various settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers CLVCH16652AIDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

CLVCH16652AIDGGREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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