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CLVC373AQPWRG4Q1

Texas Instruments

CLVC373AQPWRG4Q1 by Texas Instruments

CLVC373AQPWRG4Q1 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.5 ns at 3.3V, suitable for automotive applications due to AEC-Q100 screening. It features a small outline package with dual terminals and GULL WING form, operating b/w -40 to 125 °C, making it ideal for high-speed data transmission in automotive systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,222 parts In-Stock

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Digiode

USA . 2,324 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 440 parts In-Stock

1+ parts

$3.141

100+ parts

-

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$3.015

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$3.015

440

$3.141

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$3.015

$3.015

Parana Technologies

USA . 1,809 parts In-Stock

1+ parts

$17.508

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$17.703

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1,809

$17.508

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$17.703

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AZTECH Wire

Italy . 380 parts In-Stock

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$17.823

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$17.823

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IDEA Electronic Components Group

UK . 1,889 parts In-Stock

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$19.672

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$18.688

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$17.705

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1,889

$19.672

$18.688

$17.705

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ChromeModa Solutions

Germany . 227 parts In-Stock

1+ parts

$19.672

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$16.131

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227

$19.672

$16.131

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One Stop Electronics

USA . 402 parts In-Stock

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$34.000

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$34.000

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Component Stockers USA

USA . 493 parts In-Stock

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$99.990

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Northwest PG Solutions

USA . 1,643 parts In-Stock

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Corphita

USA . 1,411 parts In-Stock

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Native Components

USA . 589 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 117 parts In-Stock

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$17.736

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Overview

Unlock top-tier performance and reliability with the CLVC373AQPWRG4Q1 by Texas Instruments. Designed for automotive applications, this bus driver and transceiver offers seamless integration, exceptional quality, and robust functionality. With a small outline, thin profile package and dual terminal position, this product ensures optimal performance in a compact form factor. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Experience unparalleled efficiency and precision with the CLVC373AQPWRG4Q1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceiver, ensuring a longer lifespan and reliability.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and facilitating automated assembly processes.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability, making this product suitable for automotive applications where durability is critical.

Nominal Supply Voltage / Vsup (V): 2.7

The low supply voltage requirement allows for energy-efficient operation and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Technical Specifications

Bus Driver & Transceivers CLVC373AQPWRG4Q1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

CLVC373AQPWRG4Q1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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