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CLVC1G175MDBVREP

Texas Instruments

CLVC1G175MDBVREP by Texas Instruments

CLVC1G175MDBVREP by Texas Instruments is a CMOS latch with 8ns propagation delay, 16ns tpd, and 175MHz fmax. Ideal for military applications due to its small size, low power consumption, and high operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,877 parts In-Stock

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Digiode

USA . 3,121 parts In-Stock

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3,121

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Distributors (Availability)

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Native Components

USA . 451 parts In-Stock

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$7.033

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451

$7.033

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AZTECH Wire

Italy . 756 parts In-Stock

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$11.821

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One Stop Electronics

USA . 1,095 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 784 parts In-Stock

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$14.123

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$14.587

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DigiPath Technology Company

USA . 212 parts In-Stock

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$15.552

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$15.552

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ChromeModa Solutions

Germany . 4,946 parts In-Stock

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$15.869

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$13.013

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$15.869

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IDEA Electronic Components Group

UK . 46 parts In-Stock

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$15.869

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$15.076

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$14.282

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46

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Corphita

USA . 2,052 parts In-Stock

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Northwest PG Solutions

USA . 485 parts In-Stock

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$6.893

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Overview

Discover the next level of precision and reliability with the CLVC1G175MDBVREP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in their products. This latch and flip-flop device is perfect for a wide range of applications, providing seamless operation and superior performance. With a nominal supply voltage of 1.8V and a maximum frequency of 175MHz, this product offers unmatched value and benefits to customers looking for a dependable solution. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to impacts, making it suitable for various applications.

Propagation Delay At Nominal Supply: 8 ns

With a low propagation delay, this latch/flip-flop ensures fast response times and efficient operation in high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving space and making it convenient for integration into compact electronic devices.

Propackage Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, making it compatible with various mounting configurations.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage requirement of 1.8V helps in reducing power consumption and increasing efficiency in low-power applications.

Load Capacitance (CL): 50 pF

The specified load capacitance of 50 pF ensures stable and reliable operation of the latch/flip-flop in different circuit configurations.

Power Supplies (V): 3.3

The compatibility with 3.3V power supplies makes this product suitable for a wide range of electronic devices and systems operating at this voltage level.

No. of Terminals: 6

The 6 terminals offer versatile connectivity options and allow for easy interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style helps in saving space on the PCB and enables compact design solutions.

Maximum I (ol): 24 Amp

The high maximum output current capacity of 24 Amps allows this latch/flip-flop to drive demanding loads without compromising performance.

Propagation Delay (tpd): 16 ns

The propagation delay of 16 ns ensures fast signal processing and reliable operation, making it suitable for high-speed data applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this latch/flip-flop is suitable for use in environments with elevated temperatures, enhancing its versatility.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise control of the latch/flip-flop's output, enabling accurate timing and synchronization in digital circuits.

Minimum Operating Temperature: -55 °C

The wide temperature range from -55°C to 125°C allows this product to operate reliably in both extreme cold and hot environments.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit connections and allows for convenient placement on the PCB, improving design efficiency.

Maximum Seated Height: 1.45 mm

The low maximum seated height of 1.45 mm helps in reducing the overall profile of the device and enables space-saving mounting solutions.

Width: 1.6 mm

The compact width of 1.6 mm makes this latch/flip-flop suitable for applications where space constraints are a concern.

Output Polarity: TRUE

The true output polarity ensures compatibility with standard logic levels and simplifies the integration of this latch/flip-flop within digital circuits.

Minimum Supply Voltage (Vsup): 1.65 V

With a low minimum supply voltage of 1.65V, this latch/flip-flop can operate efficiently even in low-power scenarios, extending its usability.

Length: 2.9 mm

The compact length of 2.9 mm contributes to the overall small form factor of the product, making it ideal for space-constrained applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that this latch/flip-flop can withstand harsh environmental conditions and maintain performance under demanding circumstances.

Maximum Frequency At Nominal Supply: 150000000 Hz

The high maximum frequency capability of 150MHz at the nominal supply voltage enables fast data processing and high-speed operation in digital systems.

Technology: CMOS

The CMOS technology used in this latch/flip-flop offers low power consumption, high noise immunity, and compatibility with a wide range of digital ICs.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and PCB assembly, ensuring secure connections and reliable performance in electronic systems.

Packing Method: TR

The TR packing method provides convenient packaging for transportation and storage, protecting the latch/flip-flop from damage during handling and shipping.

Terminal Pitch: 0.95 mm

The narrow terminal pitch of 0.95 mm allows for high-density mounting, enabling more components to be accommodated on a PCB, maximizing circuit functionality.

Minimum fmax: 175 MHz

With a minimum fmax of 175MHz, this latch/flip-flop can operate at high frequencies, ensuring rapid data processing and consistent performance in digital circuits.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power source selection and allows this latch/flip-flop to be used in a wide range of applications.

Technical Specifications

Latches & Flip-Flops CLVC1G175MDBVREP attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

1.6 mm

Minimum fmax:

175 MHz

Trade Compliance

CLVC1G175MDBVREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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