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CLVC1G175MDCKREP

Texas Instruments

CLVC1G175MDCKREP by Texas Instruments

CLVC1G175MDCKREP by Texas Instruments is a CMOS latch with 8ns propagation delay, suitable for military applications. It operates at 1.8V nominal voltage and supports a max frequency of 175MHz. With a compact package style and low power consumption, it is ideal for high-speed signal processing in harsh environments.

Median Price

$1.768

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,646 parts In-Stock

1+ parts

$0.720

100+ parts

$0.710

1k+ parts

$0.690

10k+ parts

-

3,646

$0.720

$0.710

$0.690

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Texas Instruments

USA . 42,007 parts In-Stock

1+ parts

$1.434

100+ parts

$1.184

1k+ parts

$0.640

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42,007

$1.434

$1.184

$0.640

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Arrow

USA . 14 parts In-Stock

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$1.572

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14

$1.572

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Chip1Stop

Japan . 2,528 parts In-Stock

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$1.963

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$1.080

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$0.832

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2,528

$1.963

$1.080

$0.832

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DigiKey

USA . 10,720 parts In-Stock

1+ parts

$2.450

100+ parts

$1.491

1k+ parts

$1.414

10k+ parts

$1.242

10,720

$2.450

$1.491

$1.414

$1.242

Mouser Electronics

USA . 6,586 parts In-Stock

1+ parts

$2.450

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$1.500

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$1.450

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$1.220

6,586

$2.450

$1.500

$1.450

$1.220

Verical

USA . 14 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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$0.926

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150

$0.926

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Digiode

USA . 4,605 parts In-Stock

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$1.362

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4,605

$1.362

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Vyrian

USA . 10,747 parts In-Stock

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Bristol Electronics

USA . 2,123 parts In-Stock

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Flex Direct, LLC

USA . 92 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$0.926

100+ parts

$0.880

1k+ parts

$0.836

10k+ parts

$0.824

100

$0.926

$0.880

$0.836

$0.824

Ampacity Inc.

Singapore . 10,788 parts In-Stock

1+ parts

$1.010

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$1.010

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Corphita

USA . 1,065 parts In-Stock

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$1.291

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$1.291

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Parana Technologies

USA . 289 parts In-Stock

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$8.391

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$9.022

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289

$8.391

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$9.022

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DigiPath Technology Company

USA . 243 parts In-Stock

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$9.239

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$8.500

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243

$9.239

$8.500

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ChromeModa Solutions

Germany . 6,557 parts In-Stock

1+ parts

$9.428

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$7.731

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6,557

$9.428

$7.731

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IDEA Electronic Components Group

UK . 1,534 parts In-Stock

1+ parts

$9.428

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$8.957

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$8.485

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1,534

$9.428

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Perfect Parts

USA . 15,228 parts In-Stock

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BidChips

USA . 15,000 parts In-Stock

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iBuyXS LLC

. 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,577 parts In-Stock

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Lixinc

USA . 8,118 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,554 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Overview

Experience the cutting-edge technology of the CLVC1G175MDCKREP by Texas Instruments, a high-quality latch and flip-flop device designed for a wide range of applications. With Texas Instruments' reputation for innovation and reliability, this product offers exceptional value and benefits to customers seeking precision and efficiency. Whether you're in the military or industrial sector, this versatile component ensures optimal performance with its fast propagation delay and true output polarity. Upgrade your systems today with Texas Instruments' superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch durable and resistant to impact or environmental factors.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast response time, making the latch suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low supply voltage, saving energy and reducing heat generation.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable performance and compatibility with various circuit configurations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels.

Maximum Frequency At Nominal Supply: 150000000 Hz

High maximum frequency allows for reliable operation in high-speed digital systems.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliable performance in demanding environments and extreme temperatures.

Technical Specifications

Latches & Flip-Flops CLVC1G175MDCKREP attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

175 MHz

Trade Compliance

CLVC1G175MDCKREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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