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CDCVF2310MPWEP

Texas Instruments

CDCVF2310MPWEP by Texas Instruments

Texas Instruments CDCVF2310MPWEP is a clock driver with 4ns propagation delay, suitable for military applications. It operates at 2.5V nominal voltage and has 24 terminals in a small outline package style. With dual terminal position and standard input conditioning, it offers 5 true outputs at a max frequency of 200MHz.

Median Price

$18.220

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23,497 parts In-Stock

1+ parts

$10.192

100+ parts

$8.903

1k+ parts

$6.140

10k+ parts

-

23,497

$10.192

$8.903

$6.140

-

Mouser Electronics

USA . 240 parts In-Stock

1+ parts

$18.220

100+ parts

$12.880

1k+ parts

$11.730

10k+ parts

-

240

$18.220

$12.880

$11.730

-

DigiKey

USA . 82 parts In-Stock

1+ parts

$18.220

100+ parts

$12.880

1k+ parts

$11.738

10k+ parts

-

82

$18.220

$12.880

$11.738

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,914 parts In-Stock

1+ parts

$8.531

100+ parts

-

1k+ parts

-

10k+ parts

-

2,914

$8.531

-

-

-

Vyrian

USA . 3,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,984

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Holdelec - ElecDif-Pro

France . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,072 parts In-Stock

1+ parts

$4.157

100+ parts

-

1k+ parts

$3.991

10k+ parts

$3.991

5,072

$4.157

-

$3.991

$3.991

Native Components

USA . 902 parts In-Stock

1+ parts

$5.460

100+ parts

-

1k+ parts

-

10k+ parts

-

902

$5.460

-

-

-

Corphita

USA . 4,890 parts In-Stock

1+ parts

$8.082

100+ parts

-

1k+ parts

-

10k+ parts

-

4,890

$8.082

-

-

-

Parana Technologies

USA . 601 parts In-Stock

1+ parts

$24.413

100+ parts

$2,267.090

1k+ parts

$21.971

10k+ parts

-

601

$24.413

$2,267.090

$21.971

-

DigiPath Technology Company

USA . 2,355 parts In-Stock

1+ parts

$26.881

100+ parts

$24.731

1k+ parts

-

10k+ parts

-

2,355

$26.881

$24.731

-

-

ChromeModa Solutions

Germany . 4,500 parts In-Stock

1+ parts

$27.430

100+ parts

$22.493

1k+ parts

-

10k+ parts

-

4,500

$27.430

$22.493

-

-

IDEA Electronic Components Group

UK . 1,393 parts In-Stock

1+ parts

$27.430

100+ parts

$26.058

1k+ parts

$24.687

10k+ parts

-

1,393

$27.430

$26.058

$24.687

-

Northwest PG Solutions

USA . 1,942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.351

10k+ parts

-

1,942

-

-

$5.351

-

Perfect Parts

USA . 202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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202

-

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Overview

Enhance your electronic designs with the CDCVF2310MPWEP by Texas Instruments, a top-notch clock driver and buffer that guarantees precision and reliability. Crafted by the renowned manufacturer, this product is ideal for a wide range of applications in various industries. With fast propagation delay and multiple functions, this device ensures seamless performance. Its small, rectangular package makes it convenient for surface mounting, while its wide operating temperature range caters to different environments. Trust in Texas Instruments for quality products that deliver exceptional value and unmatched benefits to meet all your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed applications.

No. of Functions: 2

Having multiple functions in one product saves space on the circuit board and simplifies the overall design.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage of 2.5V ensures consistent performance and compatibility with a variety of systems.

Maximum Operating Temperature: 125 °C

The wide operating temperature range of up to 125°C allows this product to be used in harsh environments without compromising performance.

Technical Specifications

Clock Drivers & Buffers CDCVF2310MPWEP attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDCV

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.17 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

200 MHz

Trade Compliance

CDCVF2310MPWEP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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