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CDCU877ZQLR

Texas Instruments

CDCU877ZQLR by Texas Instruments

CDCU877ZQLR clock driver by Texas Instruments operates at 1.8V, with 52 terminals in a grid array package style. It features differential input conditioning, 3-STATE output characteristics, and a max operating temperature of 85°C. Ideal for industrial applications requiring high-speed performance up to 340MHz.

Median Price

$4.399

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38,900 parts In-Stock

1+ parts

-

100+ parts

$3.910

1k+ parts

$3.500

10k+ parts

$3.300

38,900

-

$3.910

$3.500

$3.300

Verical

USA . 21,900 parts In-Stock

1+ parts

-

100+ parts

$4.888

1k+ parts

$4.375

10k+ parts

$4.125

21,900

-

$4.888

$4.375

$4.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,401 parts In-Stock

1+ parts

$4.123

100+ parts

-

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4,401

$4.123

-

-

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DigiKey Marketplace

USA . 38,900 parts In-Stock

1+ parts

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38,900

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Vyrian

USA . 8,095 parts In-Stock

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8,095

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Component Sense

UK . 234 parts In-Stock

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234

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Prism Electronics

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 96 parts In-Stock

1+ parts

$3.906

100+ parts

-

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-

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96

$3.906

-

-

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Andel Nordic

Denmark . 441 parts In-Stock

1+ parts

$3.912

100+ parts

-

1k+ parts

$3.756

10k+ parts

$3.756

441

$3.912

-

$3.756

$3.756

Native Components

USA . 880 parts In-Stock

1+ parts

$19.925

100+ parts

-

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880

$19.925

-

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Northwest PG Solutions

USA . 1,209 parts In-Stock

1+ parts

$21.917

100+ parts

$19.726

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1,209

$21.917

$19.726

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Parana Technologies

USA . 1,372 parts In-Stock

1+ parts

$23.535

100+ parts

$2,185.597

1k+ parts

$21.182

10k+ parts

-

1,372

$23.535

$2,185.597

$21.182

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DigiPath Technology Company

USA . 2,092 parts In-Stock

1+ parts

$25.915

100+ parts

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2,092

$25.915

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ChromeModa Solutions

Germany . 4,079 parts In-Stock

1+ parts

$26.444

100+ parts

$21.684

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4,079

$26.444

$21.684

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IDEA Electronic Components Group

UK . 1,866 parts In-Stock

1+ parts

$26.444

100+ parts

$25.122

1k+ parts

$23.800

10k+ parts

-

1,866

$26.444

$25.122

$23.800

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Kepictronics

USA . 30,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,863 parts In-Stock

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6,863

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Alle Elektronik GmbH

Germany . 4,575 parts In-Stock

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4,575

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Microchip USA

USA . 4,110 parts In-Stock

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4,110

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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ChipstoGo Electronic ltd

UK . 61 parts In-Stock

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61

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Overview

Experience the unparalleled quality and precision of Texas Instruments with the CDCU877ZQLR Clock Drivers & Buffers. Designed for optimal performance, this product offers a wide range of applications in various industries. With its innovative technology and reliable construction, customers can trust in the value and benefits that this clock driver provides. Enhance your projects with the CDCU877ZQLR and unlock a world of possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making the product suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V ensures compatibility with a wide range of systems and devices.

Maximum I (ol): 9 Amp

High output current capacity of 9A allows the product to drive multiple loads efficiently.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand harsh environmental conditions and perform reliably in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Minimum fmax: 340 MHz

High maximum frequency of 340MHz ensures fast operation and responsiveness, making the product suitable for high-performance applications.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the product has moderate sensitivity to moisture, allowing for safe handling and storage in typical manufacturing environments.

Technical Specifications

Clock Drivers & Buffers CDCU877ZQLR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

877

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PBGA-B52

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA52,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.5 mm

Minimum fmax:

340 MHz

Trade Compliance

CDCU877ZQLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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