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CDCU877ARHARG4

Texas Instruments

CDCU877ARHARG4 by Texas Instruments

CDCU877ARHARG4 clock driver by Texas Instruments operates at 1.8V, with 40 terminals in a square package style. It features differential input conditioning, 10 true outputs, and a max frequency of 340MHz. Ideal for industrial applications requiring precise timing control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,970 parts In-Stock

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8,970

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Digiode

USA . 2,017 parts In-Stock

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2,017

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Classic Components Corporation

USA . 1,088 parts In-Stock

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Native Components

USA . 696 parts In-Stock

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$0.049

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-

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$0.047

696

$0.049

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$0.047

Andel Nordic

Denmark . 5,545 parts In-Stock

1+ parts

$2.928

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-

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$2.811

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$2.811

5,545

$2.928

-

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$2.811

AZTECH Wire

Italy . 769 parts In-Stock

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$6.156

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$6.156

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Parana Technologies

USA . 1,689 parts In-Stock

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$29.164

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$56.226

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$29.164

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$56.226

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ChromeModa Solutions

Germany . 3,420 parts In-Stock

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$32.768

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$26.870

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$32.768

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IDEA Electronic Components Group

UK . 1,974 parts In-Stock

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$32.768

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$31.130

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$29.491

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$29.491

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One Stop Electronics

USA . 1,285 parts In-Stock

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$39.000

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Component Stockers USA

USA . 1,715 parts In-Stock

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$71.040

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A-Z Elektronik GmbH

Germany . 6,203 parts In-Stock

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Microchip USA

USA . 4,975 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,135 parts In-Stock

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Corphita

USA . 3,855 parts In-Stock

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Northwest PG Solutions

USA . 686 parts In-Stock

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Perfect Parts

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DigiPath Technology Company

USA . 130 parts In-Stock

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$29.544

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Kepictronics

USA . 39 parts In-Stock

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Overview

Enhance your electronic designs with the CDCU877ARHARG4 clock driver from Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments offers a wide range of clock drivers and buffers that cater to a variety of applications. The CDCU877ARHARG4 stands out for its innovative design, delivering precise timing signals and efficient power management. With its advanced features and durable construction, this clock driver is a valuable addition to any project, providing customers with superior performance and long-term benefits. Experience the difference with Texas Instruments CDCU877ARHARG4 - the perfect choice for your next electronics venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver and buffer, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and making integration into electronic systems more efficient.

Input Conditioning: DIFFERENTIAL

Enables accurate signal processing and noise reduction, resulting in reliable clock signal generation.

Nominal Supply Voltage / Vsup (V): 1.8

Stable supply voltage ensures consistent operation of the clock driver and buffer.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where temperatures may vary, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, making it suitable for a wide range of environments.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the clock driver and buffer can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Clock Drivers & Buffers CDCU877ARHARG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

877

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

40

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Minimum fmax:

340 MHz

Trade Compliance

CDCU877ARHARG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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