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CDCU877ANMKT

Texas Instruments

CDCU877ANMKT by Texas Instruments

Texas Instruments CDCU877ANMKT is a clock driver with 52 terminals, operating at -40 to 85°C. It offers differential input conditioning, 0.65mm terminal pitch, and 10 true outputs at max frequency of 340MHz. Ideal for industrial applications requiring precise timing control in compact spaces.

Median Price

$12.630

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 190 parts In-Stock

1+ parts

$12.630

100+ parts

$8.500

1k+ parts

$6.420

10k+ parts

-

190

$12.630

$8.500

$6.420

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,538

-

-

-

-

Digiode

USA . 4,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 848 parts In-Stock

1+ parts

$9.507

100+ parts

-

1k+ parts

$9.126

10k+ parts

$9.126

848

$9.507

-

$9.126

$9.126

Parana Technologies

USA . 1,965 parts In-Stock

1+ parts

$12.545

100+ parts

-

1k+ parts

$12.998

10k+ parts

-

1,965

$12.545

-

$12.998

-

DigiPath Technology Company

USA . 342 parts In-Stock

1+ parts

$13.813

100+ parts

-

1k+ parts

-

10k+ parts

-

342

$13.813

-

-

-

ChromeModa Solutions

Germany . 5,760 parts In-Stock

1+ parts

$14.095

100+ parts

$11.558

1k+ parts

-

10k+ parts

-

5,760

$14.095

$11.558

-

-

IDEA Electronic Components Group

UK . 1,896 parts In-Stock

1+ parts

$14.095

100+ parts

$13.390

1k+ parts

$12.686

10k+ parts

-

1,896

$14.095

$13.390

$12.686

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,594

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Native Components

USA . 856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.740

10k+ parts

-

856

-

-

$3.740

-

Corphita

USA . 432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

432

-

-

-

-

Northwest PG Solutions

USA . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.779

10k+ parts

-

259

-

-

$3.779

-

Overview

Experience superior performance and reliability with the Texas Instruments CDCU877ANMKT clock drivers and buffers. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This product is ideal for a wide range of applications, offering customers unmatched value and benefits. Trust Texas Instruments to provide innovative solutions for all your clock driver and buffer needs. Elevate your projects with the CDCU877ANMKT and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and facilitating efficient assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning ensures accurate data transmission and reception, reducing signal interference.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V provides energy efficiency and compatibility with low-power systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at -40°C ensures functionality in extreme cold conditions, making it suitable for a wide range of applications.

Width: 4.5 mm

The compact width of 4.5mm allows for space-efficient PCB layout, enabling the integration of multiple components within a limited space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate degree of sensitivity to moisture, requiring proper handling and storage to maintain performance.

Technical Specifications

Clock Drivers & Buffers CDCU877ANMKT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PBGA-B52

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA52,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

235 mA

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.5 mm

Minimum fmax:

340 MHz

Trade Compliance

CDCU877ANMKT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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