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CDCU877ARTB

Texas Instruments

CDCU877ARTB by Texas Instruments

The Texas Instruments CDCU877ARTB clock driver features 40 terminals, operates at a supply voltage of 1.8V, and has a max output current of 9A. It is designed for industrial applications requiring differential input conditioning and offers a min operating temperature of -40°C and max operating temperature of 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,062 parts In-Stock

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8,062

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Digiode

USA . 173 parts In-Stock

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173

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Sensible Micro Corp

USA . 18 parts In-Stock

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18

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LWI Electronics Inc

India . 5 parts In-Stock

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5

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Distributors (Availability)

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One Stop Electronics

USA . 1,605 parts In-Stock

1+ parts

$4.000

100+ parts

-

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1,605

$4.000

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Andel Nordic

Denmark . 3,259 parts In-Stock

1+ parts

$4.285

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-

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$4.114

10k+ parts

$4.114

3,259

$4.285

-

$4.114

$4.114

Parana Technologies

USA . 2,025 parts In-Stock

1+ parts

$7.140

100+ parts

-

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$7.653

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-

2,025

$7.140

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$7.653

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ChromeModa Solutions

Germany . 4,993 parts In-Stock

1+ parts

$8.022

100+ parts

$6.578

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4,993

$8.022

$6.578

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IDEA Electronic Components Group

UK . 63 parts In-Stock

1+ parts

$8.022

100+ parts

-

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$7.220

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63

$8.022

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$7.220

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AZTECH Wire

Italy . 362 parts In-Stock

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$10.719

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362

$10.719

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Native Components

USA . 344 parts In-Stock

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$17.388

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344

$17.388

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Northwest PG Solutions

USA . 1,216 parts In-Stock

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$19.127

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$17.214

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1,216

$19.127

$17.214

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DigiPath Technology Company

USA . 1,263 parts In-Stock

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$7.233

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1,263

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$7.233

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Corphita

USA . 240 parts In-Stock

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240

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Overview

Unleash the power of precision timing with the CDCU877ARTB clock driver & buffer by Texas Instruments. Crafted with top-notch quality and expertise, this innovative product is designed to elevate your applications to new heights of performance and reliability. Whether you're working on telecommunications, networking, or industrial automation projects, this chip carrier with a very thin profile offers unparalleled value and benefits. Trust Texas Instruments to deliver cutting-edge solutions that enhance your designs and exceed your expectations. Elevate your work with the CDCU877ARTB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the clock driver, ensuring longer product lifespan.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact electronic designs where space is limited.

Input Conditioning: DIFFERENTIAL

Differential input conditioning allows for improved noise immunity and signal integrity, making the clock driver suitable for high-performance applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing the clock driver to interface with different components and systems.

Minimum Operating Temperature: -40 °C

The clock driver can operate reliably in low temperature environments, making it suitable for a wide range of industrial applications.

Technical Specifications

Clock Drivers & Buffers CDCU877ARTB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

877

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e0

Length:

6 mm

Logic IC Type:

Maximum I (ol):

9 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

40

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

.9 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Minimum fmax:

340 MHz

Trade Compliance

CDCU877ARTB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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