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CDC351IDBR

Texas Instruments

CDC351IDBR by Texas Instruments

The Texas Instruments CDC351IDBR clock driver has a propagation delay of 4.2ns, operates at 3.3V, and offers 10 true outputs. Ideal for industrial applications requiring a small outline package with standard input conditioning and a max operating temperature of 85°C.

Median Price

$9.457

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,862 parts In-Stock

1+ parts

$9.457

100+ parts

$8.261

1k+ parts

$5.697

10k+ parts

-

24,862

$9.457

$8.261

$5.697

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,035 parts In-Stock

1+ parts

$8.984

100+ parts

-

1k+ parts

-

10k+ parts

-

4,035

$8.984

-

-

-

Chip Stock

USA . 20,741 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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20,741

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Vyrian

USA . 3,115 parts In-Stock

1+ parts

-

100+ parts

-

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3,115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 912 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

10k+ parts

-

912

$0.880

-

-

-

Northwest PG Solutions

USA . 1,353 parts In-Stock

1+ parts

$0.968

100+ parts

-

1k+ parts

-

10k+ parts

-

1,353

$0.968

-

-

-

Andel Nordic

Denmark . 4,005 parts In-Stock

1+ parts

$4.760

100+ parts

-

1k+ parts

$4.569

10k+ parts

$4.569

4,005

$4.760

-

$4.569

$4.569

Corphita

USA . 133 parts In-Stock

1+ parts

$8.511

100+ parts

-

1k+ parts

-

10k+ parts

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133

$8.511

-

-

-

Parana Technologies

USA . 1,069 parts In-Stock

1+ parts

$14.644

100+ parts

-

1k+ parts

$15.080

10k+ parts

-

1,069

$14.644

-

$15.080

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DigiPath Technology Company

USA . 1,127 parts In-Stock

1+ parts

$16.125

100+ parts

-

1k+ parts

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10k+ parts

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1,127

$16.125

-

-

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ChromeModa Solutions

Germany . 5,687 parts In-Stock

1+ parts

$16.454

100+ parts

$13.492

1k+ parts

-

10k+ parts

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5,687

$16.454

$13.492

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-

IDEA Electronic Components Group

UK . 450 parts In-Stock

1+ parts

$16.454

100+ parts

$15.631

1k+ parts

$14.809

10k+ parts

-

450

$16.454

$15.631

$14.809

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AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$19.600

100+ parts

-

1k+ parts

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456

$19.600

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Lixinc

USA . 17,506 parts In-Stock

1+ parts

-

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17,506

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance your electronic design projects with the Texas Instruments CDC351IDBR clock driver and buffer. Crafted with precision and expertise, this product offers impeccable quality and reliability in the realm of clock drivers & buffers. From ensuring signal integrity to enhancing system performance, this device is a must-have for any industrial application requiring precise timing control. Experience seamless operation and superior performance with the CDC351IDBR, setting new standards in the world of electronics. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures fast signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount packaging.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it versatile for various applications.

Load Capacitance (CL): 50 pF

Suitable for driving loads with moderate capacitance, ensuring stable performance.

Maximum I (ol): 32 Amp

High output current capability allows driving of heavy loads without external amplification.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial temperature conditions, ensuring reliability in demanding environments.

Technology: BICMOS

Utilizes BiCMOS technology for a combination of high-speed performance and low power consumption.

Technical Specifications

Clock Drivers & Buffers CDC351IDBR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

351

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

4.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.9 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC351IDBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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