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CDC328ADBRG4

Texas Instruments

CDC328ADBRG4 by Texas Instruments

Texas Instruments CDC328ADBRG4 is Clock Driver & Buffer with 5ns Propagation Delay, 16 Terminals, and 100MHz Min fmax. Ideal for industrial applications requiring precise clock signal distribution in a compact Small Outline package with Surface Mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,937 parts In-Stock

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Vyrian

USA . 1,940 parts In-Stock

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Bristol Electronics

USA . 1,700 parts In-Stock

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1,700

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Distributors (Availability)

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Andel Nordic

Denmark . 1,327 parts In-Stock

1+ parts

$3.081

100+ parts

-

1k+ parts

$2.957

10k+ parts

$2.957

1,327

$3.081

-

$2.957

$2.957

Corohmni

South Africa . 212 parts In-Stock

1+ parts

$15.133

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212

$15.133

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One Stop Electronics

USA . 1,370 parts In-Stock

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$16.000

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$16.000

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AZTECH Wire

Italy . 815 parts In-Stock

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$19.465

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815

$19.465

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Parana Technologies

USA . 2,180 parts In-Stock

1+ parts

$22.864

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$23.525

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2,180

$22.864

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$23.525

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$23.425

100+ parts

$21.317

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$19.208

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$23.425

$21.317

$19.208

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

1+ parts

$25.690

100+ parts

$24.406

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$23.121

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1,199

$25.690

$24.406

$23.121

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ChromeModa Solutions

Germany . 1,106 parts In-Stock

1+ parts

$25.690

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$21.066

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$25.690

$21.066

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Component Stockers USA

USA . 776 parts In-Stock

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$99.990

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776

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 7,656 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 3,952 parts In-Stock

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Corphita

USA . 1,059 parts In-Stock

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DigiPath Technology Company

USA . 796 parts In-Stock

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$23.162

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Native Components

USA . 650 parts In-Stock

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Northwest PG Solutions

USA . 132 parts In-Stock

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Overview

Enhance your electronic designs with the CDC328ADBRG4 clock driver and buffer from Texas Instruments. Crafted with precision and expertise, this product offers unparalleled performance and reliability in clock distribution. Ideal for a variety of applications, this small outline package delivers a fast propagation delay of 5ns and operates within an industrial temperature grade range. With standard input conditioning and a maximum seated height of 2mm, this clock driver ensures seamless integration and optimal functionality. Trust in Texas Instruments for top-tier quality and take your designs to the next level with the CDC328ADBRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 5 ns

Low propagation delay ensures fast response time and efficient operation of the clock driver.

Surface Mount: YES

Surface mount capability makes installation and assembly easier, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with many electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat resistance is required.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the product to function in various environments, including extreme cold conditions.

Technology: BICMOS

Built-in complementary metal-oxide-semiconductor (CMOS) technology provides a high level of integration and low power consumption for efficient performance.

Technical Specifications

Clock Drivers & Buffers CDC328ADBRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

COMBINATIONS OF TRUE AND COMPLEMENTARY OUTPUTS POSSIBLE WITH POLARITY-CONTROL INPUTS

Family:

328

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Logic IC Type:

Maximum I (ol):

48 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC328ADBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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