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CDC2351DBRG4

Texas Instruments

CDC2351DBRG4 by Texas Instruments

CDC2351DBRG4 clock driver by Texas Instruments has 4.8 ns propagation delay at 3.3V, suitable for applications requiring 100 MHz fmax and 50 pF load capacitance. With a small outline package style, it is ideal for commercial temperature grade surface mount designs needing 10 true outputs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,575 parts In-Stock

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Digiode

USA . 159 parts In-Stock

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159

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Andel Nordic

Denmark . 5,951 parts In-Stock

1+ parts

$2.927

100+ parts

-

1k+ parts

$2.810

10k+ parts

$2.810

5,951

$2.927

-

$2.810

$2.810

AZTECH Wire

Italy . 846 parts In-Stock

1+ parts

$9.785

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846

$9.785

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Native Components

USA . 791 parts In-Stock

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$12.766

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791

$12.766

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Northwest PG Solutions

USA . 2,132 parts In-Stock

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$14.043

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$12.638

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2,132

$14.043

$12.638

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One Stop Electronics

USA . 995 parts In-Stock

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$24.000

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995

$24.000

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Parana Technologies

USA . 551 parts In-Stock

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$28.274

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$45.638

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551

$28.274

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$45.638

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ChromeModa Solutions

Germany . 6,326 parts In-Stock

1+ parts

$31.768

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$26.050

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$31.768

$26.050

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IDEA Electronic Components Group

UK . 490 parts In-Stock

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$31.768

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$30.180

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$28.591

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490

$31.768

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$28.591

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Kepictronics

USA . 3,200 parts In-Stock

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Microchip USA

USA . 2,256 parts In-Stock

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Corphita

USA . 1,047 parts In-Stock

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DigiPath Technology Company

USA . 875 parts In-Stock

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$28.642

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$28.642

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Overview

Enhance your clock signal integrity with the CDC2351DBRG4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. As part of the Clock Drivers & Buffers category, this product offers precise signal conditioning and a fast propagation delay of 4.8 ns. Perfect for various applications, this small outline package provides a nominal supply voltage of 3.3V and includes 10 true outputs with 3-state characteristics. Trust Texas Instruments to deliver cutting-edge technology that ensures optimal performance and value for all your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.8 ns

Low propagation delay ensures fast signal transmission, making it suitable for high-speed clock applications.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used voltage level, making it compatible with a wide range of systems and devices.

Maximum I (ol): 12 Amp

Can drive high current loads, making it suitable for applications that require driving multiple components.

Technology: BICMOS

Utilizes a combination of bipolar and CMOS technologies, offering high-speed performance with low power consumption.

Maximum Operating Temperature: 70 °C

Can operate in a wide temperature range, making it suitable for industrial and automotive applications.

Technical Specifications

Clock Drivers & Buffers CDC2351DBRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2351

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

15 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC2351DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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