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CDC204DWRG4

Texas Instruments

CDC204DWRG4 by Texas Instruments

CDC204DWRG4 by Texas Instruments is a logic gate with 6 functions, 5.7 ns propagation delay at 5V, and 50 pF load capacitance. It is used in applications requiring fast signal processing and operates within a temperature range of 25-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,083 parts In-Stock

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4,083

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Digiode

USA . 3,324 parts In-Stock

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3,324

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Distributors (Availability)

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Native Components

USA . 70 parts In-Stock

1+ parts

$6.465

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-

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70

$6.465

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Parana Technologies

USA . 711 parts In-Stock

1+ parts

$13.000

100+ parts

$1,207.269

1k+ parts

$11.700

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-

711

$13.000

$1,207.269

$11.700

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DigiPath Technology Company

USA . 1,182 parts In-Stock

1+ parts

$14.315

100+ parts

$13.170

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$14.315

$13.170

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ChromeModa Solutions

Germany . 4,993 parts In-Stock

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$14.607

100+ parts

$11.978

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4,993

$14.607

$11.978

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IDEA Electronic Components Group

UK . 745 parts In-Stock

1+ parts

$14.607

100+ parts

$13.877

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$13.146

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745

$14.607

$13.877

$13.146

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AZTECH Wire

Italy . 422 parts In-Stock

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$16.868

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422

$16.868

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Corohmni

South Africa . 179 parts In-Stock

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$19.132

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179

$19.132

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$25.346

100+ parts

$23.065

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$20.784

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5,000

$25.346

$23.065

$20.784

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One Stop Electronics

USA . 1,584 parts In-Stock

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$34.000

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1,584

$34.000

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Northwest PG Solutions

USA . 1,060 parts In-Stock

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$6.336

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Microchip USA

USA . 240 parts In-Stock

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Corphita

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Overview

Enhance your electronic designs with the CDC204DWRG4 by Texas Instruments, a leading manufacturer known for top-quality logic gates. Perfect for a wide range of applications, this versatile component offers customers unrivaled value and benefits. With a fast propagation delay, small outline package style, and dual terminal position, this product is designed for efficiency and reliability. Trust Texas Instruments to deliver superior performance in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and reliable for long-term use.

Propagation Delay At Nominal Supply: 5.7 ns

Low propagation delay ensures fast response time and efficient operation.

Surface Mount: YES

Surface mount capability allows for easy installation and compact circuit design.

No. of Functions: 6

Having multiple functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V ensures compatibility with common electronic devices.

Load Capacitance (CL): 50 pF

Suitable load capacitance for stable and efficient operation in various circuit configurations.

Power Supplies (V): 5

Consistent power supply voltage of 5V supports reliable and stable performance.

No. of Terminals: 20

Sufficient number of terminals for versatile connectivity options in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact circuit board layout.

Maximum I (ol): 24 Amp

High output current capability for driving various loads in the circuit.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable performance in different environmental conditions.

Minimum Operating Temperature: 25 °C

Low minimum operating temperature ensures functionality in various temperature conditions.

Terminal Position: DUAL

Dual terminal position for easy and secure soldering in circuit assembly.

Maximum Seated Height: 2.65 mm

Low seated height for compact and space-efficient circuit design.

Width: 7.5 mm

Narrow width for fitting into tight spaces on the circuit board.

Minimum Supply Voltage (Vsup): 4.75 V

Low minimum supply voltage for operation in low-power applications.

Length: 12.825 mm

Optimal length for accommodating the required circuit connections and components.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and mechanical stability.

Packing Method: TR

TR packing method for convenient handling and storage of multiple components.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common circuit board designs.

Maximum Supply Voltage (Vsup): 5.25 V

Safe maximum supply voltage to prevent overloading and ensure component longevity.

Technical Specifications

Logic Gates CDC204DWRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

204

JESD-30 Code:

R-PDSO-G20

Length:

12.825 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.7 ns

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CDC204DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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