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CDC204-7DW

Texas Instruments

CDC204-7DW by Texas Instruments

Texas Instruments CDC204-7DW logic gates have 6 functions with a propagation delay of 5.7 ns at 5V supply, suitable for applications requiring fast signal processing. This small outline package features a max I (ol) of 24 Amp and operates b/w -25°C to +70°C temperatures, making it ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,310 parts In-Stock

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Digiode

USA . 3,679 parts In-Stock

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3,679

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Distributors (Availability)

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Native Components

USA . 923 parts In-Stock

1+ parts

$0.792

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923

$0.792

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Northwest PG Solutions

USA . 1,247 parts In-Stock

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$0.871

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$0.871

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AZTECH Wire

Italy . 302 parts In-Stock

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$19.232

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302

$19.232

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Parana Technologies

USA . 1,000 parts In-Stock

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$27.163

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$32.819

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1,000

$27.163

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$32.819

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DigiPath Technology Company

USA . 1,940 parts In-Stock

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$29.910

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$29.910

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IDEA Electronic Components Group

UK . 2,223 parts In-Stock

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$30.520

100+ parts

$28.994

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$27.468

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2,223

$30.520

$28.994

$27.468

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ChromeModa Solutions

Germany . 1,973 parts In-Stock

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$30.520

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$25.026

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One Stop Electronics

USA . 1,261 parts In-Stock

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$41.000

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Corphita

USA . 1,501 parts In-Stock

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Overview

Enhance your electronic designs with the CDC204-7DW by Texas Instruments, a top-quality logic gate that offers unparalleled performance and reliability. With a compact rectangular package and dual terminal position, this versatile component is perfect for a wide range of applications. From consumer electronics to industrial automation, the CDC204-7DW delivers fast propagation delay and low power consumption, making it a valuable asset for your projects. Trust Texas Instruments for cutting-edge technology and elevate your designs with the CDC204-7DW today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and resistant to corrosion, making it a durable choice.

Propagation Delay At Nominal Supply: 5.7 ns

The low propagation delay ensures fast signal processing, making this product suitable for applications where timing is critical.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 6

With 6 functions in one package, this product offers increased functionality while taking up less space on the PCB.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used supply voltage of 5V, this product is compatible with many standard electronic systems.

Load Capacitance (CL): 50 pF

Having a low load capacitance helps in reducing signal distortion and improving overall circuit performance.

Power Supplies (V): 5

Matching the power supply voltage with the nominal supply voltage ensures stable and reliable operation of the product.

No. of Terminals: 20

The high number of terminals provides flexibility in connecting the device to other components, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in conserving space on the PCB, making it suitable for compact electronic devices.

Maximum I (ol): 24 Amp

The high maximum output current capability allows this product to drive various loads, making it versatile for different applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: 25 °C

The low minimum operating temperature ensures that the product can function effectively in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout and enables easy connection with other components.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for a slim profile, making it suitable for applications with space constraints.

Width: 7.52 mm

The compact width of the product helps in saving space on the PCB and allows for efficient component placement.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage requirement ensures operation in a wide voltage range, providing flexibility in power source selection.

Length: 12.825 mm

The moderate length of the product offers a balance between functionality and space-saving, making it ideal for various applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering during assembly, ensuring robust connections for reliable performance.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact PCB designs and efficient use of space, ideal for densely populated circuits.

Maximum Supply Voltage (Vsup): 5.25 V

The high maximum supply voltage tolerance provides a margin of safety against voltage fluctuations, ensuring the product's stability.

Technical Specifications

Logic Gates CDC204-7DW attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

CDC

JESD-30 Code:

R-PDSO-G20

Length:

12.825 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.7 ns

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.52 mm

Trade Compliance

CDC204-7DW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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