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CDC204-7N

Texas Instruments

CDC204-7N by Texas Instruments

The Texas Instruments CDC204-7N logic gate features 6 functions with a propagation delay of 5.7 ns at 5V supply, suitable for applications requiring fast signal processing. With a load capacitance of 50 pF and operating temperature range from 25 to 70°C, it is ideal for compact designs needing high-speed performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,454 parts In-Stock

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8,454

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Digiode

USA . 1,830 parts In-Stock

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1,830

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Distributors (Availability)

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AZTECH Wire

Italy . 399 parts In-Stock

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$13.314

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-

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399

$13.314

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Parana Technologies

USA . 1,592 parts In-Stock

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$24.099

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-

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$24.751

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1,592

$24.099

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$24.751

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DigiPath Technology Company

USA . 228 parts In-Stock

1+ parts

$26.535

100+ parts

$24.413

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228

$26.535

$24.413

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ChromeModa Solutions

Germany . 1,702 parts In-Stock

1+ parts

$27.077

100+ parts

$22.203

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1,702

$27.077

$22.203

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IDEA Electronic Components Group

UK . 949 parts In-Stock

1+ parts

$27.077

100+ parts

$25.723

1k+ parts

$24.369

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949

$27.077

$25.723

$24.369

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One Stop Electronics

USA . 409 parts In-Stock

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$35.000

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409

$35.000

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Corphita

USA . 4,172 parts In-Stock

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Northwest PG Solutions

USA . 451 parts In-Stock

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451

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Native Components

USA . 393 parts In-Stock

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393

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Overview

Enhance your electronic projects with the CDC204-7N logic gates from Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers reliable components that exceed industry standards. Ideal for a wide range of applications, these logic gates offer fast propagation delay and low power consumption. With 6 functions packed into one compact package, you can streamline your designs and save valuable board space. Trust in Texas Instruments to provide the value and performance you need for your next project. Elevate your circuits with the CDC204-7N logic gates today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 5.7 ns

Fast propagation delay ensures quick response times when processing signals, making it suitable for high-speed applications.

No. of Functions: 6

Having multiple functions in a single package offers versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Power Supplies (V): 5

Operates efficiently with a standard 5V power supply, ensuring stable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures without performance degradation, suitable for a wide range of operating environments.

Technical Specifications

Logic Gates CDC204-7N attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

CDC

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.7 ns

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CDC204-7N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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