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CDC203DWG4

Texas Instruments

CDC203DWG4 by Texas Instruments

CDC203DWG4 by Texas Instruments is a CMOS logic gate with 6 functions, 6.1 ns propagation delay at 3.3V supply voltage, and 30 pF load capacitance. It is used in applications requiring fast signal processing and operates within -25°C to 70°C temperature range.

Median Price

$18.740

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 44 parts In-Stock

1+ parts

$18.740

100+ parts

$10.350

1k+ parts

$10.080

10k+ parts

-

44

$18.740

$10.350

$10.080

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$9.030

100+ parts

-

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500

$9.030

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Digiode

USA . 4,053 parts In-Stock

1+ parts

$15.932

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4,053

$15.932

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Vyrian

USA . 9,719 parts In-Stock

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9,719

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Distributors (Availability)

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Netroflash

USA . 100 parts In-Stock

1+ parts

$9.030

100+ parts

-

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100

$9.030

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Continental Prestige Electronics

USA . 2 parts In-Stock

1+ parts

$9.030

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-

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$8.849

2

$9.030

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-

$8.849

Corohmni

South Africa . 337 parts In-Stock

1+ parts

$9.030

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-

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337

$9.030

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Ampacity Inc.

Singapore . 45 parts In-Stock

1+ parts

$14.260

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45

$14.260

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Corphita

USA . 3,306 parts In-Stock

1+ parts

$15.093

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3,306

$15.093

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AZTECH Wire

Italy . 631 parts In-Stock

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$15.471

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$15.471

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Parana Technologies

USA . 1,788 parts In-Stock

1+ parts

$25.750

100+ parts

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$26.355

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1,788

$25.750

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$26.355

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DigiPath Technology Company

USA . 1,698 parts In-Stock

1+ parts

$28.354

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1,698

$28.354

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ChromeModa Solutions

Germany . 5,976 parts In-Stock

1+ parts

$28.933

100+ parts

$23.725

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5,976

$28.933

$23.725

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IDEA Electronic Components Group

UK . 2,247 parts In-Stock

1+ parts

$28.933

100+ parts

$27.486

1k+ parts

$26.040

10k+ parts

-

2,247

$28.933

$27.486

$26.040

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Semicontronic

India . 45 parts In-Stock

1+ parts

$31.040

100+ parts

$30.264

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$30.109

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45

$31.040

$30.264

$30.109

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Microchip USA

USA . 935 parts In-Stock

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Argo Parts USA

USA . 314 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments CDC203DWG4 Logic Gates. Crafted with precision and expertise, this high-quality product offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the CDC203DWG4 delivers seamless operation and exceptional efficiency, making it the ideal choice for all your logic gate needs. Experience the value and benefits of Texas Instruments' superior craftsmanship with the CDC203DWG4 – where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 6.1 ns

Low propagation delay ensures fast processing of signals, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 6

Having multiple functions in a single component increases efficiency and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common voltage level of 3.3V makes integration with other components in the system easier.

Load Capacitance (CL): 30 pF

Low load capacitance helps in reducing power consumption and improving overall performance of the logic gates.

Power Supplies (V): 3.3

Consistent power supply voltage of 3.3V ensures stable operation and reliable performance.

No. of Terminals: 20

Having a sufficient number of terminals allows for easy connection with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space and is ideal for applications with limited board space.

Maximum I (ol): 12 Amp

High output current capability of 12A allows for driving multiple loads and ensures compatibility with a wide range of applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: 25 °C

A low minimum operating temperature of 25°C ensures reliable operation even in colder environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout and reduces the risk of errors during installation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering during assembly on circuit boards.

Packing Method: TUBE

Tube packing method ensures safe transportation and storage of the logic gates, preventing damage or contamination.

Technical Specifications

Logic Gates CDC203DWG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

203

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6.1 ns

Propagation Delay (tpd):

6.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Minimum fmax:

40 MHz

Trade Compliance

CDC203DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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