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CD4572UBNSR

Texas Instruments

CD4572UBNSR by Texas Instruments

CD4572UBNSR by Texas Instruments is a CMOS logic gate with 4 functions, 200 ns propagation delay at 5V. It operates in temperatures from -55 to 125°C and has a max power supply current of 0.15 mA. Ideal for military-grade applications requiring high-speed logic operations.

Median Price

$1.425

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,647 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.140

10k+ parts

$1.010

11,647

-

$1.370

$1.140

$1.010

DigiKey

USA . 11,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.710

10k+ parts

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11,647

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-

$1.710

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Verical

USA . 7,235 parts In-Stock

1+ parts

-

100+ parts

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$1.425

10k+ parts

$1.262

7,235

-

-

$1.425

$1.262

Distributors (In-Stock)

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Vyrian

USA . 2,274 parts In-Stock

1+ parts

$0.880

100+ parts

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2,274

$0.880

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Digiode

USA . 2,288 parts In-Stock

1+ parts

$0.922

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-

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2,288

$0.922

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DigiKey Marketplace

USA . 12,735 parts In-Stock

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12,735

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,674 parts In-Stock

1+ parts

$0.874

100+ parts

-

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3,674

$0.874

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Native Components

USA . 998 parts In-Stock

1+ parts

$1.829

100+ parts

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998

$1.829

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Northwest PG Solutions

USA . 1,942 parts In-Stock

1+ parts

$2.012

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1,942

$2.012

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Parana Technologies

USA . 1,187 parts In-Stock

1+ parts

$20.059

100+ parts

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1k+ parts

$19.989

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1,187

$20.059

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$19.989

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DigiPath Technology Company

USA . 598 parts In-Stock

1+ parts

$22.087

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598

$22.087

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IDEA Electronic Components Group

UK . 1,913 parts In-Stock

1+ parts

$22.538

100+ parts

$21.411

1k+ parts

$20.284

10k+ parts

-

1,913

$22.538

$21.411

$20.284

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ChromeModa Solutions

Germany . 122 parts In-Stock

1+ parts

$22.538

100+ parts

$18.481

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122

$22.538

$18.481

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Perfect Parts

USA . 5,772 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,729 parts In-Stock

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5,729

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Overview

Discover the power of precision with the CD4572UBNSR by Texas Instruments, a top-quality logic gate that offers unmatched reliability and performance. Perfect for a wide range of applications, this product features a durable plastic/epoxy package body and a compact rectangular shape, making it ideal for any project. With a nominal supply voltage of 5V and low propagation delay, this logic gate ensures efficient operation at all times. Trust in Texas Instruments for superior technology that delivers exceptional value and benefits to customers, setting your projects up for success every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 200 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and space-efficient PCB assembly.

No. of Functions: 4

With 4 functions in one package, this product offers cost and space savings compared to using multiple individual logic gates.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common 5V supply voltage, making it compatible with standard logic circuits.

Load Capacitance (CL): 50 pF

Designed to handle a load capacitance of 50 pF, ensuring stable performance in varying load conditions.

Power Supplies (V): 5/15

Supports multiple power supply voltages (5V and 15V), giving flexibility in design and compatibility with different systems.

No. of Terminals: 16

Provides a sufficient number of terminals for interfacing with other components and circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for high-density circuit design.

Maximum I (ol): 6.8 Amp

High output current capability of 6.8 Amps enables driving of heavy loads without external buffers.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of -55°C to 125°C ensures reliable operation in harsh environments.

Temperature Grade: MILITARY

Military-grade temperature range and reliability make this product suitable for rugged applications and mission-critical systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product suitable for battery-powered devices and noise-sensitive applications.

Technical Specifications

Logic Gates CD4572UBNSR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

MIXED WITH ONE 2-INPUT NOR & ONE 2-INPUT NAND GATE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.15 mA

Propagation Delay At Nominal Supply:

200 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

CD4572UBNSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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