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CD4572UBPWRE4

Texas Instruments

CD4572UBPWRE4 by Texas Instruments

CD4572UBPWRE4 by Texas Instruments is a CMOS logic gate with 4 functions, 200 ns propagation delay at 5V. It operates in temperatures ranging from -55 to 125 °C and has a max supply voltage of 18V. Ideal for military-grade applications due to its small outline package and low power consumption.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,598 parts In-Stock

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Digiode

USA . 457 parts In-Stock

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Nova Conductors

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One Stop Electronics

USA . 925 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 584 parts In-Stock

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$13.942

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Parana Technologies

USA . 804 parts In-Stock

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$16.841

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$1,563.986

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$15.157

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DigiPath Technology Company

USA . 1,025 parts In-Stock

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$18.545

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ChromeModa Solutions

Germany . 3,916 parts In-Stock

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$18.923

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$15.517

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

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$17.977

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$17.031

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Ampacity Inc.

Singapore . 1,357 parts In-Stock

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Component Stockers USA

USA . 424 parts In-Stock

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Corphita

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Microchip USA

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Argo Parts USA

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Bastille Electronics

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Overview

Unlock the power of cutting-edge technology with the CD4572UBPWRE4 by Texas Instruments. Crafted with precision and expertise, this logic gate offers unmatched quality and reliability. Ideal for a wide range of applications, this product provides seamless integration and exceptional performance. With a focus on value and innovation, Texas Instruments delivers a superior product that exceeds customer expectations. Experience the advantages of advanced technology with the CD4572UBPWRE4 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this product lightweight and durable, suitable for a variety of applications.

Propagation Delay At Nominal Supply: 200 ns

With a low propagation delay, this logic gate ensures fast and efficient signal processing.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

This logic gate combines four functions in one package, providing versatility and increasing overall functionality.

Nominal Supply Voltage: 5V

With a nominal supply voltage of 5V, this logic gate is compatible with a wide range of systems and circuits.

Load Capacitance: 50 pF

The low load capacitance of 50 pF reduces signal distortion and interference, ensuring accurate signal processing.

Power Supplies: 5/15V

Supporting dual power supplies of 5V and 15V, this logic gate offers flexibility in voltage requirements for different applications.

No. of Terminals: 16

With 16 terminals, this logic gate allows for easy connection to other components in a circuit.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package save space on the circuit board, making it ideal for compact designs.

Maximum I (ol): 6.8 Amp

The high maximum output current of 6.8 Amps enables this logic gate to drive heavy loads without overheating.

Propagation Delay: 200 ns

The propagation delay of 200 ns ensures fast signal processing, making this logic gate suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this logic gate can withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows this logic gate to function reliably in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, enhancing compatibility with different circuit layouts.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm minimizes space requirements, making this logic gate suitable for compact designs.

Width: 4.4 mm

The narrow width of 4.4 mm saves space on the circuit board, making this logic gate ideal for crowded layouts.

Minimum Supply Voltage: 3V

With a minimum supply voltage of 3V, this logic gate can operate efficiently in low-power applications.

Peak Reflow Temperature: 260 C

The high peak reflow temperature of 260°C ensures reliable solder connections during the assembly process.

Length: 5 mm

The compact length of 5 mm saves space on the circuit board, making this logic gate suitable for small-scale applications.

Temperature Grade: MILITARY

Designed for military-grade applications, this logic gate meets stringent performance and reliability standards.

Technology: CMOS

The CMOS technology used in this logic gate offers low power consumption and high noise immunity, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure mechanical connections, ensuring stable operation in various environments.

Packing Method: TR

The reel packing method simplifies storage and transportation, making this logic gate convenient for mass production.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65 mm allows for high-density mounting, making this logic gate suitable for compact designs.

Maximum Supply Voltage: 18V

With a maximum supply voltage of 18V, this logic gate can operate reliably in high-power applications.

Maximum Power Supply Current: 0.15 mA

The low maximum power supply current of 0.15 mA minimizes power consumption, making this logic gate energy-efficient.

Technical Specifications

Logic Gates CD4572UBPWRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

MIXED WITH ONE 2-INPUT NOR & ONE 2-INPUT NAND GATE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.15 mA

Propagation Delay At Nominal Supply:

200 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD4572UBPWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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