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CD4508BPWRG4

Texas Instruments

CD4508BPWRG4 by Texas Instruments

CD4508BPWRG4 by Texas Instruments is a 2-function bus driver with 4 bits and 3-STATE output. It operates at a nominal voltage of 5V, has a propagation delay of 210ns, and can handle load capacitance up to 50pF. Ideal for military-grade applications requiring reliable signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,974 parts In-Stock

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Digiode

USA . 3,861 parts In-Stock

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3,861

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Nova Conductors

Japan . 55 parts In-Stock

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AZTECH Wire

Italy . 500 parts In-Stock

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$6.443

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500

$6.443

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Andel Nordic

Denmark . 1,719 parts In-Stock

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$7.199

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$6.911

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$6.911

1,719

$7.199

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$6.911

Semicontronic

India . 737 parts In-Stock

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$17.000

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$16.575

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$16.490

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737

$17.000

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$16.490

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Corohmni

South Africa . 69 parts In-Stock

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$17.114

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69

$17.114

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Parana Technologies

USA . 976 parts In-Stock

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$21.341

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$21.669

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$21.341

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$21.669

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DigiPath Technology Company

USA . 1,430 parts In-Stock

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$23.499

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$23.499

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ChromeModa Solutions

Germany . 6,934 parts In-Stock

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$23.979

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$19.663

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$23.979

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IDEA Electronic Components Group

UK . 1,770 parts In-Stock

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$23.979

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$22.780

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$21.581

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One Stop Electronics

USA . 1,497 parts In-Stock

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$56.000

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Ampacity Inc.

Singapore . 1,518 parts In-Stock

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Continental Prestige Electronics

USA . 6,679 parts In-Stock

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Corphita

USA . 3,186 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 681 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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$23.113

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$21.403

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$21.403

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$21.403

Advanced Electronics

New Zealand . 50 parts In-Stock

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Overview

Enhance your electronics projects with the CD4508BPWRG4 by Texas Instruments, a top-quality bus driver and transceiver designed to deliver reliable performance. With Texas Instruments' reputable manufacturing standards, this versatile component offers unparalleled value and benefits for a wide range of applications. Whether you're working on signal transmission or data communication, this product's efficient design and advanced features will ensure seamless operation and optimal results. Upgrade your projects today with the CD4508BPWRG4 and experience the difference that Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 210 ns

With a low propagation delay, this product offers fast signal transmission, ensuring efficient communication in bus driver and transceiver applications.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional components, simplifying the design and reducing overall cost.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard voltage levels, ensuring easy integration into existing systems.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product can drive capacitive loads efficiently without signal degradation, maintaining signal integrity.

Power Supplies (V): 5/15

The ability to support multiple power supplies of 5V and 15V offers flexibility in power input options, making it adaptable to different power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without deterioration, ensuring reliable performance in harsh conditions.

Minimum Operating Temperature: -55 °C

The wide temperature range allows this product to operate in extreme cold environments, providing versatility in deployment locations.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state, enabling bus drivers to disconnect from the bus line when not in use, reducing power consumption.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in data transmission.

Technical Specifications

Bus Driver & Transceivers CD4508BPWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

210 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CD4508BPWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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