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CD4502BF3A

Texas Instruments

CD4502BF3A by Texas Instruments

CD4502BF3A by Texas Instruments is a 6-bit bus driver with 380ns propagation delay at 5V. It features 16 terminals, operates b/w -55 to 125°C, and has a max power supply current of 0.03mA. Ideal for military-grade applications requiring inverted output polarity and enable low control type.

Median Price

$17.055

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Chip1Stop

Japan . 436 parts In-Stock

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$17.055

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$16.825

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Freelance Electronics

USA . 204 parts In-Stock

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$5.704

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$5.989

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$5.647

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American Microsemiconductor Inc.

USA . 122 parts In-Stock

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$26.870

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Vyrian

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Digiode

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Eagle Technology Solutions

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Beltway Electronics Company

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M&R Communications

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PC Components Company LLC

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Bristol Electronics

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Electronic Expediters

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Corel Iberica Componentes, S.L.

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Resion

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Mil-Aero Solutions, Inc.

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Distributors (Availability)

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Native Components

USA . 992 parts In-Stock

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$0.145

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$0.140

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$0.145

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Northwest PG Solutions

USA . 925 parts In-Stock

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$0.160

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$0.141

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$0.160

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Ampacity Inc.

Singapore . 93 parts In-Stock

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$14.500

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Parana Technologies

USA . 894 parts In-Stock

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$19.231

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$19.271

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DigiPath Technology Company

USA . 180 parts In-Stock

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$21.176

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ChromeModa Solutions

Germany . 3,364 parts In-Stock

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$21.608

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$17.719

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IDEA Electronic Components Group

UK . 1,789 parts In-Stock

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$21.608

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$20.528

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$19.447

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Andel Nordic

Denmark . 432 parts In-Stock

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Kepictronics

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Microchip USA

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Supply Digital

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Corphita

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Assy Fe

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Overview

Enhance your electronic projects with the CD4502BF3A by Texas Instruments, a top-tier bus driver & transceiver that boasts unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this component offers seamless integration, fast propagation delay, and exceptional output characteristics in a compact package. Perfect for a wide range of applications, this versatile product ensures optimal performance and durability. Upgrade your designs with the CD4502BF3A and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability for the product, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 380 ns

Fast propagation delay ensures quick signal transmission, making this product efficient for communication applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage, ensuring compatibility with most systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Bus Driver & Transceivers CD4502BF3A attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH COMMON INHIBIT FOR ALL BITS

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.03 mA

Propagation Delay At Nominal Supply:

380 ns

Propagation Delay (tpd):

380 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

7.62 mm

Trade Compliance

CD4502BF3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-094-1263, 5962010941263, 5962-01-125-7400, 5962011257400, 5962-01-139-5055, 5962011395055, 5962-01-173-5528, 5962011735528

NIIN

010941263, 011257400, 011395055, 011735528

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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