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CD4508BPWG4

Texas Instruments

CD4508BPWG4 by Texas Instruments

CD4508BPWG4 by Texas Instruments is a 24-terminal bus driver with 210ns propagation delay at 5V. It features a small outline package, operates in temperatures from -55 to 125 °C, and has true output polarity. Ideal for military-grade applications requiring reliable signal transmission over short distances.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,023 parts In-Stock

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Digiode

USA . 3,666 parts In-Stock

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3,666

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Nova Conductors

Japan . 46 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 990 parts In-Stock

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$3.451

100+ parts

-

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$3.313

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$3.313

990

$3.451

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$3.313

$3.313

One Stop Electronics

USA . 1,347 parts In-Stock

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$7.000

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-

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1,347

$7.000

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AZTECH Wire

Italy . 422 parts In-Stock

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$18.237

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$18.237

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Corohmni

South Africa . 278 parts In-Stock

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$25.634

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$25.634

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Parana Technologies

USA . 553 parts In-Stock

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$25.733

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$26.334

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$25.733

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$26.334

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IDEA Electronic Components Group

UK . 2,262 parts In-Stock

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$28.913

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$27.467

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$26.022

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$27.467

$26.022

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ChromeModa Solutions

Germany . 2,083 parts In-Stock

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$28.913

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$23.709

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Ampacity Inc.

Singapore . 1,541 parts In-Stock

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$30.000

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Continental Prestige Electronics

USA . 4,836 parts In-Stock

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Argo Parts USA

USA . 3,049 parts In-Stock

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DigiPath Technology Company

USA . 1,839 parts In-Stock

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$26.068

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Corphita

USA . 1,519 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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$13.547

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$12.545

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$12.545

250

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$13.547

$12.545

$12.545

Overview

Experience seamless data transmission and enhanced connectivity with the CD4508BPWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in the Bus Driver & Transceivers category. This versatile product offers 4 bits of functionality and a propagation delay of just 210 ns, ensuring quick and efficient performance. Ideal for a range of applications, this compact device boasts a small outline package and 3-state output characteristics. Elevate your projects with the reliability and precision of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight material for the package, ensuring long-lasting performance and ease of handling.

Propagation Delay At Nominal Supply: 210 ns

Low propagation delay ensures efficient and fast signal transmission, making it suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard and commonly used voltage level, making it compatible with a wide range of systems and applications.

No. of Terminals: 24

Provides ample connectivity options for interfacing with other components, enhancing flexibility and functionality.

Width: 4.4 mm

Compact width allows for efficient use of space on a PCB, especially in crowded layouts or when size constraints are a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers CD4508BPWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

210 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CD4508BPWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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