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CD4508BPWR

Texas Instruments

CD4508BPWR by Texas Instruments

CD4508BPWR by Texas Instruments is a 4-bit bus driver with 210 ns propagation delay at 5V. It has a small outline package, operates b/w -55 to 125 °C, and supports up to 18V supply voltage. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,869 parts In-Stock

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Digiode

USA . 697 parts In-Stock

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Nova Conductors

Japan . 28 parts In-Stock

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Andel Nordic

Denmark . 2,352 parts In-Stock

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$2.936

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-

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$2.818

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$2.818

2,352

$2.936

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$2.818

$2.818

AZTECH Wire

Italy . 358 parts In-Stock

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$7.790

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358

$7.790

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One Stop Electronics

USA . 1,555 parts In-Stock

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$18.000

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$18.000

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Corohmni

South Africa . 93 parts In-Stock

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$18.943

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93

$18.943

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Ampacity Inc.

Singapore . 671 parts In-Stock

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$20.000

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671

$20.000

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Parana Technologies

USA . 1,170 parts In-Stock

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$24.827

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$25.504

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$24.827

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$25.504

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DigiPath Technology Company

USA . 1,535 parts In-Stock

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$27.338

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$27.338

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IDEA Electronic Components Group

UK . 1,465 parts In-Stock

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$27.896

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$26.501

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$25.106

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$27.896

$26.501

$25.106

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ChromeModa Solutions

Germany . 1,016 parts In-Stock

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$27.896

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$22.875

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$27.896

$22.875

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QUARKTWIN TECHNOLOGY LTD

USA . 15,696 parts In-Stock

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Corphita

USA . 4,213 parts In-Stock

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Continental Prestige Electronics

USA . 3,512 parts In-Stock

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Microchip USA

USA . 2,761 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Argo Parts USA

USA . 1,691 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Overview

Enhance your electronic projects with the Texas Instruments CD4508BPWR, a top-quality bus driver & transceiver designed to deliver outstanding performance. With a reputation for excellence in manufacturing, Texas Instruments brings you a product that is reliable, efficient, and versatile. Ideal for a wide range of applications, this 4-bit device offers exceptional value and benefits to customers seeking seamless connectivity and precision in their designs. Upgrade your projects with the CD4508BPWR and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 210 ns

The low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable makes installation of the product easy and convenient, saving time and effort during the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is common and widely available, making it compatible with a variety of systems and devices.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows for flexible control of the output signal, enhancing the versatility and functionality of the product.

Technical Specifications

Bus Driver & Transceivers CD4508BPWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

210 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CD4508BPWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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