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CD4502BMG4

Texas Instruments

CD4502BMG4 by Texas Instruments

CD4502BMG4 by Texas Instruments is a 6-bit bus driver with 380ns propagation delay at 5V. It features 3-STATE output, operates b/w -55 to 125 °C, and has a MILITARY temperature grade. Ideal for applications requiring fast signal transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,337 parts In-Stock

1+ parts

-

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6,337

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Digiode

USA . 1,203 parts In-Stock

1+ parts

-

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1,203

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 16 parts In-Stock

1+ parts

$6.645

100+ parts

-

1k+ parts

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16

$6.645

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One Stop Electronics

USA . 1,061 parts In-Stock

1+ parts

$9.000

100+ parts

-

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-

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1,061

$9.000

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AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$12.455

100+ parts

-

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456

$12.455

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Parana Technologies

USA . 611 parts In-Stock

1+ parts

$26.751

100+ parts

$2,484.211

1k+ parts

$24.076

10k+ parts

-

611

$26.751

$2,484.211

$24.076

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DigiPath Technology Company

USA . 247 parts In-Stock

1+ parts

$29.456

100+ parts

$27.099

1k+ parts

-

10k+ parts

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247

$29.456

$27.099

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ChromeModa Solutions

Germany . 5,850 parts In-Stock

1+ parts

$30.057

100+ parts

$24.647

1k+ parts

-

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5,850

$30.057

$24.647

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IDEA Electronic Components Group

UK . 90 parts In-Stock

1+ parts

$30.057

100+ parts

$28.554

1k+ parts

$27.051

10k+ parts

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90

$30.057

$28.554

$27.051

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Corphita

USA . 4,963 parts In-Stock

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4,963

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Northwest PG Solutions

USA . 1,469 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$6.512

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1,469

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$6.512

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Overview

Enhance your electronic projects with the top-quality CD4502BMG4 by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers exceptional bus driver & transceivers that guarantee reliability and performance. With a wide range of applications, this product offers value by providing efficient signal transmission and control. Experience the benefits of quick propagation delay and 3-state output characteristics, all packed into a compact small outline package. Trust Texas Instruments for cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ensuring a longer lifespan and ease of handling.

Propagation Delay At Nominal Supply: 380 ns

The low propagation delay ensures fast and efficient data transmission, making this bus driver & transceiver ideal for applications requiring quick response times.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product onto circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, allowing for easy compatibility and integration with existing setups.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows for reliable operation in various environmental conditions, making this product suitable for industrial or outdoor use.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this bus driver & transceiver energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers CD4502BMG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH COMMON INHIBIT FOR ALL BITS

Control Type:

ENABLE LOW

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

380 ns

Propagation Delay (tpd):

380 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4502BMG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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