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CC2560ARVMT

Texas Instruments

CC2560ARVMT by Texas Instruments

CC2560ARVMT by Texas Instruments is a telecom IC with 76 terminals, operating at -40 to 85°C. It has a data rate of 4 Mbps and operates at a supply voltage of 3.6 V. This chip carrier package is suitable for telecom circuit applications requiring surface mount technology.

Median Price

$4.513

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

195

-

$3.610

$3.230

$3.040

DigiKey

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$4.750

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-

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195

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$4.750

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Verical

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$4.513

1k+ parts

$4.037

10k+ parts

$3.800

195

-

$4.513

$4.037

$3.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 112 parts In-Stock

1+ parts

$3.334

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-

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112

$3.334

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Vyrian

USA . 8,707 parts In-Stock

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8,707

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Prism Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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Native Components

USA . 846 parts In-Stock

1+ parts

$0.046

100+ parts

-

1k+ parts

-

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$0.045

846

$0.046

-

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$0.045

Corphita

USA . 1,075 parts In-Stock

1+ parts

$3.159

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-

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1,075

$3.159

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Component Stockers USA

USA . 200 parts In-Stock

1+ parts

$3.560

100+ parts

$3.350

1k+ parts

-

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200

$3.560

$3.350

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Parana Technologies

USA . 1,314 parts In-Stock

1+ parts

$10.493

100+ parts

-

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$11.004

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1,314

$10.493

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$11.004

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DigiPath Technology Company

USA . 1,895 parts In-Stock

1+ parts

$11.554

100+ parts

$10.630

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-

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1,895

$11.554

$10.630

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ChromeModa Solutions

Germany . 6,505 parts In-Stock

1+ parts

$11.790

100+ parts

$9.668

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6,505

$11.790

$9.668

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IDEA Electronic Components Group

UK . 503 parts In-Stock

1+ parts

$11.790

100+ parts

$11.200

1k+ parts

$10.611

10k+ parts

-

503

$11.790

$11.200

$10.611

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Advanced Electronics

New Zealand . 96 parts In-Stock

1+ parts

$14.492

100+ parts

$13.188

1k+ parts

$11.883

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96

$14.492

$13.188

$11.883

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QUARKTWIN TECHNOLOGY LTD

USA . 3,044 parts In-Stock

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3,044

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Perfect Parts

USA . 1,734 parts In-Stock

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1,734

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Northwest PG Solutions

USA . 317 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the Texas Instruments CC2560ARVMT. Designed with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures smooth data transfer and communication. Experience enhanced performance and efficiency with the CC2560ARVMT, providing customers with value, benefits, and advantages that go beyond expectations. Trust in Texas Instruments for cutting-edge technology that delivers exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for portable devices.

Surface Mount: YES

Being surface mount compatible makes it easier to integrate the IC into compact and densely populated circuit boards.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage of 3.6V is common in many telecom applications, ensuring compatibility and ease of integration into existing systems.

Data Rate: 4 Mbps

The high data rate of 4 Mbps allows for fast and efficient data transmission in telecom applications, improving overall performance.

Technical Specifications

Other Function Telecom Interface ICs CC2560ARVMT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4 Mbps

JESD-30 Code:

R-PQCC-N76

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

76

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.73 mm

Trade Compliance

CC2560ARVMT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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