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BUF07702PWPRG4

Texas Instruments

BUF07702PWPRG4 by Texas Instruments

BUF07702PWPRG4 by Texas Instruments is a buffer amplifier with 15000uV max input offset voltage, 0.0002uA max average bias current, and 1MHz nominal bandwidth. Ideal for applications requiring low bias current and high precision amplification in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,827 parts In-Stock

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Vyrian

USA . 3,992 parts In-Stock

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Parana Technologies

USA . 2,017 parts In-Stock

1+ parts

$3.298

100+ parts

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$3.822

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2,017

$3.298

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$3.822

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DigiPath Technology Company

USA . 2,008 parts In-Stock

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$3.632

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$3.632

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ChromeModa Solutions

Germany . 3,087 parts In-Stock

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$3.706

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$3.039

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$3.706

$3.039

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IDEA Electronic Components Group

UK . 977 parts In-Stock

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$3.706

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$3.335

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977

$3.706

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$3.335

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AZTECH Wire

Italy . 231 parts In-Stock

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$5.398

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231

$5.398

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One Stop Electronics

USA . 940 parts In-Stock

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$8.410

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940

$8.410

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Native Components

USA . 827 parts In-Stock

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$8.881

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$8.881

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Northwest PG Solutions

USA . 1,145 parts In-Stock

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$9.769

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$8.792

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$9.769

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QUARKTWIN TECHNOLOGY LTD

USA . 2,136 parts In-Stock

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Corphita

USA . 517 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the BUF07702PWPRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality buffer amplifiers that excel in performance and reliability. Ideal for a wide range of applications, this buffer amplifier offers customers exceptional value with its precise signal processing capabilities and efficient power consumption. Elevate your projects with the trusted brand of Texas Instruments and experience the advantages of the BUF07702PWPRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection against environmental factors, making the product suitable for a variety of applications.

Maximum Input Offset Voltage: 15000 uV

Low input offset voltage ensures accurate signal processing and minimal errors in the output.

Maximum Average Bias Current (IIB): 0.0002 uA

Low bias current helps in reducing power consumption and maintaining signal integrity.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

Nominal Supply Voltage / Vsup (V): 10

Optimal supply voltage for efficient performance of the buffer amplifier.

No. of Terminals: 20

Sufficient number of terminals for connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Slim and compact design with heat sink feature for better thermal management and space constraints in applications.

Maximum Supply Voltage Limit: 16.5 V

High supply voltage limit allows for reliable operation under varying input conditions.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for suitability in different environments.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions without any performance degradation.

Terminal Position: DUAL

Dual terminal position enhances connection stability and signal transmission efficiency.

Maximum Seated Height: 1.2 mm

Low seated height for compact and space-efficient PCB layout.

Width: 4.4 mm

Narrow width for easy integration into circuit boards with limited space.

Nominal Bandwidth (3dB): 1 MHz

Wide bandwidth for efficient signal amplification and transmission across a range of frequencies.

Length: 6.5 mm

Compact length for fitting into tight spaces and maintaining a neat circuit layout.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure connections in the circuit.

Amplifier Type: BUFFER

Buffer amplifier type provides impedance matching and signal isolation for enhanced signal quality.

Nominal Slow Rate: 1 V/us

Slow rate ensures gradual signal amplification and stability in signal processing.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise and secure connections in the circuit design.

Technical Specifications

Buffer Amplifiers BUF07702PWPRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

1 MHz

Nominal Slew Rate:

1 V/us

Input Offset Voltage Limit:

15 mV

Peak Bias Current:

200 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.256 in (6.5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

20

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G20

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

BUF07702PWPRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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