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BF905

Texas Instruments

BF905 by Texas Instruments

Texas Instruments BF905 is a N-CHANNEL FET with 0.04A max drain current and 0.15W power dissipation. Ideal for surface mount applications, it operates up to 150°C. Suitable for low-power circuits in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,211 parts In-Stock

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6,211

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Digiode

USA . 1,977 parts In-Stock

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1,977

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LittleDiode

UK . 12 parts In-Stock

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12

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GES GmbH

Germany . 10 parts In-Stock

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10

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Holdelec - ElecDif-Pro

France . 7 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 358 parts In-Stock

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$0.171

100+ parts

-

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$0.165

358

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$0.165

Northwest PG Solutions

USA . 1,456 parts In-Stock

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$0.189

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$0.166

1,456

$0.189

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$0.166

Parana Technologies

USA . 1,590 parts In-Stock

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$1.582

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$2.217

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1,590

$1.582

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$2.217

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DigiPath Technology Company

USA . 291 parts In-Stock

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$1.741

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$1.602

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291

$1.741

$1.602

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

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$1.777

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$1.599

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$1.777

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$1.599

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ChromeModa Solutions

Germany . 2,171 parts In-Stock

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$1.777

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$1.457

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One Stop Electronics

USA . 707 parts In-Stock

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$3.050

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707

$3.050

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AZTECH Wire

Italy . 363 parts In-Stock

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$13.985

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363

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Corphita

USA . 1,089 parts In-Stock

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Assy Fe

Spain . 12 parts In-Stock

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Overview

Elevate your power management solutions with the BF905 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The BF905, a Power Field Effect Transistor (FET) with N-CHANNEL polarity, offers efficient power control in a compact and convenient single configuration. Ideal for various applications, this FET is designed to deliver maximum performance with a maximum drain current of 0.04 A and a maximum power dissipation of 0.15 W. Trust Texas Instruments to provide you with the cutting-edge technology you need to stay ahead of the curve.

Feature Benefit Bullets

Polarity/Channel Type: N-CHANNEL

N-CHANNEL FETs offer low on-state resistance and high input impedance, making them efficient for switching applications.

Configuration: SINGLE

Single configuration FETs are easy to use and require simpler circuit design compared to dual or quad configurations.

Surface Mount: YES

Surface mount FETs are compact and easy to solder onto PCBs, saving space and enabling automated assembly.

Maximum Drain Current (Abs) (ID): 0.04 A

With a relatively high maximum drain current, this FET can handle moderate power loads effectively.

Maximum Power Dissipation (Abs): 0.15 W

This FET has a low power dissipation, helping to reduce heat generation and improve overall efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers good switching performance, low power consumption, and high reliability.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand demanding environmental conditions and operate reliably in various applications.

Maximum Drain Current (ID): 0.04 A

Having a consistent maximum drain current rating ensures stable performance under typical operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) BF905 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.04 A

Maximum Drain Current (ID):

.04 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

BF905 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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