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BF904A,215

NXP Semiconductors

BF904A,215 by NXP Semiconductors

BF904A,215 by NXP Semiconductors is an N-channel FET designed for dual gate enhancement mode applications. It supports a max drain current of 30 mA and power dissipation of 200 mW, operating up to 150 °C. Ideal for RF amplification in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,120 parts In-Stock

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Digiode

USA . 1,284 parts In-Stock

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Anansix

USA . 725 parts In-Stock

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725

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Native Components

USA . 207 parts In-Stock

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$8.302

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207

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Northwest PG Solutions

USA . 1,819 parts In-Stock

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$9.133

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$8.219

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AZTECH Wire

Italy . 708 parts In-Stock

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$9.750

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One Stop Electronics

USA . 1,514 parts In-Stock

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$61.050

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Component Stockers USA

USA . 469 parts In-Stock

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$99.990

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469

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UNI Independent Distributors

Spain . 6,457 parts In-Stock

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Corphita

USA . 1,833 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the BF904A,215 from NXP Semiconductors! Designed for superior performance and reliability, this N-channel Power FET is perfect for a multitude of applications, from RF amplification to signal modulation. With NXP's renowned commitment to quality and cutting-edge technology, you can trust this device to enhance your designs, providing outstanding efficiency and durability that drive success in every project. Elevate your solutions today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better electron mobility, resulting in faster switching speeds, making this product ideal for high-performance applications.

Configuration: SINGLE

A single configuration simplifies design and integration into circuits, allowing for easier implementation in various electronic projects.

Surface Mount: YES

Surface mount technology enables compact designs and efficient assembly processes, making this FET suitable for modern electronics where space is limited.

Operating Mode: DUAL GATE, ENHANCEMENT MODE

The dual gate design provides improved control and better performance in RF and analog applications, giving this FET versatility for various uses.

Maximum Drain Current (Abs) (ID): 0.03 A

A maximum drain current of 0.03 A provides adequate power handling for low to moderate power applications, ensuring the FET can operate efficiently without overheating.

Maximum Power Dissipation (Abs): 0.2 W

With a maximum power dissipation of 0.2 W, this FET effectively manages heat, enhancing reliability and longevity in circuit applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for low gate power and high input impedance, translating to reduced energy consumption and better suitability for battery-operated devices.

Maximum Operating Temperature: 150 °C

Operating at a temperature of up to 150 °C ensures this FET can perform reliably in demanding environments, making it a robust choice for industrial applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish enhances solderability and helps prevent corrosion, ensuring durability and reliable connections in manufacturing and end-use.

Maximum Drain Current (ID): 0.03 A

Reiterating the maximum drain current of 0.03 A ensures that this product adheres to specifications, maintaining consistent performance across applications.

Technical Specifications

Power Field Effect Transistors (FET) BF904A,215 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Trade Compliance

BF904A,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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