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ADC34J45IRGZT

Texas Instruments

ADC34J45IRGZT by Texas Instruments

ADC, PROPRIETARY METHOD; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$97.237

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,665 parts In-Stock

1+ parts

$97.237

100+ parts

$88.016

1k+ parts

$83.825

10k+ parts

-

2,665

$97.237

$88.016

$83.825

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,399 parts In-Stock

1+ parts

$92.375

100+ parts

-

1k+ parts

-

10k+ parts

-

1,399

$92.375

-

-

-

Vyrian

USA . 5,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,603

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 871 parts In-Stock

1+ parts

$0.038

100+ parts

-

1k+ parts

-

10k+ parts

$0.036

871

$0.038

-

-

$0.036

AZTECH Wire

Italy . 53 parts In-Stock

1+ parts

$15.440

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$15.440

-

-

-

Parana Technologies

USA . 755 parts In-Stock

1+ parts

$17.087

100+ parts

-

1k+ parts

$17.302

10k+ parts

-

755

$17.087

-

$17.302

-

DigiPath Technology Company

USA . 742 parts In-Stock

1+ parts

$18.815

100+ parts

-

1k+ parts

-

10k+ parts

-

742

$18.815

-

-

-

IDEA Electronic Components Group

UK . 2,350 parts In-Stock

1+ parts

$19.199

100+ parts

$18.239

1k+ parts

$17.279

10k+ parts

-

2,350

$19.199

$18.239

$17.279

-

ChromeModa Solutions

Germany . 1,810 parts In-Stock

1+ parts

$19.199

100+ parts

$15.743

1k+ parts

-

10k+ parts

-

1,810

$19.199

$15.743

-

-

Corphita

USA . 3,124 parts In-Stock

1+ parts

$87.513

100+ parts

-

1k+ parts

-

10k+ parts

-

3,124

$87.513

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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22,003

-

-

-

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Lixinc

USA . 7,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,990

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

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Northwest PG Solutions

USA . 1,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,220

-

-

-

-

Perfect Parts

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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280

-

-

-

-

Technical Specifications

Analog-to-Digital Converters ADC34J45IRGZT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

160 MHz

Maximum Conversion Time:

6.25 ns

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC34J45IRGZT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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