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ADC3542IRSBT

Texas Instruments

ADC3542IRSBT by Texas Instruments

ADC3542IRSBT by Texas Instruments is a 14-bit ADC with 0.012817% max linearity error, operating at 25 MHz sample rate. It features a 40-terminal chip carrier package suitable for applications requiring high-speed analog-to-digital conversion. With a wide temperature range from -40 to 105 °C, it is ideal for industrial and automotive electronics.

Median Price

$38.890

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 160 parts In-Stock

1+ parts

$30.524

100+ parts

$27.132

1k+ parts

$19.950

10k+ parts

-

160

$30.524

$27.132

$19.950

-

DigiKey

USA . 470 parts In-Stock

1+ parts

$38.890

100+ parts

$30.627

1k+ parts

-

10k+ parts

-

470

$38.890

$30.627

-

-

Mouser Electronics

USA . 483 parts In-Stock

1+ parts

$44.660

100+ parts

$33.160

1k+ parts

$31.790

10k+ parts

-

483

$44.660

$33.160

$31.790

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,112 parts In-Stock

1+ parts

$28.998

100+ parts

-

1k+ parts

-

10k+ parts

-

4,112

$28.998

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$30.663

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$30.663

-

-

-

VNN

France . 735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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735

-

-

-

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Vyrian

USA . 26 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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26

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 158 parts In-Stock

1+ parts

$14.631

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$14.631

-

-

-

Parana Technologies

USA . 2,343 parts In-Stock

1+ parts

$23.867

100+ parts

-

1k+ parts

$24.500

10k+ parts

-

2,343

$23.867

-

$24.500

-

DigiPath Technology Company

USA . 420 parts In-Stock

1+ parts

$26.281

100+ parts

-

1k+ parts

-

10k+ parts

-

420

$26.281

-

-

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IDEA Electronic Components Group

UK . 2,266 parts In-Stock

1+ parts

$26.817

100+ parts

$25.476

1k+ parts

$24.135

10k+ parts

-

2,266

$26.817

$25.476

$24.135

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ChromeModa Solutions

Germany . 1,930 parts In-Stock

1+ parts

$26.817

100+ parts

$21.990

1k+ parts

-

10k+ parts

-

1,930

$26.817

$21.990

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-

Corphita

USA . 2,233 parts In-Stock

1+ parts

$27.472

100+ parts

-

1k+ parts

-

10k+ parts

-

2,233

$27.472

-

-

-

Continental Prestige Electronics

USA . 6,597 parts In-Stock

1+ parts

$30.663

100+ parts

-

1k+ parts

-

10k+ parts

$30.050

6,597

$30.663

-

-

$30.050

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$30.663

100+ parts

$30.050

1k+ parts

-

10k+ parts

-

2,000

$30.663

$30.050

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$31.276

100+ parts

$31.276

1k+ parts

$31.276

10k+ parts

-

5,000

$31.276

$31.276

$31.276

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Ampacity Inc.

Singapore . 371 parts In-Stock

1+ parts

$56.470

100+ parts

-

1k+ parts

-

10k+ parts

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371

$56.470

-

-

-

Semicontronic

India . 7 parts In-Stock

1+ parts

$56.470

100+ parts

$55.058

1k+ parts

$54.776

10k+ parts

-

7

$56.470

$55.058

$54.776

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Argo Parts USA

USA . 3,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,342

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Overview

Unlock unparalleled precision and performance with the ADC3542IRSBT by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers unmatched quality and reliability in every product. Ideal for a wide range of applications, this converter offers exceptional value and benefits to customers seeking top-tier performance. Experience superior accuracy and efficiency with the ADC3542IRSBT, setting new standards in data conversion technology. Elevate your projects with Texas Instruments and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and efficient performance.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving design.

Package Shape: SQUARE

The square package shape enables efficient integration into various electronic devices.

No. of Bits: 14

With 14 bits, this ADC offers high resolution and accurate digital conversion.

Maximum Linearity Error (EL): 0.012817 %

The low linearity error ensures precise and reliable analog-to-digital conversion.

No. of Terminals: 40

The 40 terminals provide flexibility for connecting to other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package styles offer versatility for different application requirements.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this ADC suitable for various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for easy connection and secure mounting.

Maximum Seated Height: 0.8 mm

The low maximum seated height enables compact design and space efficiency.

Width: 5 mm

The compact width makes this ADC suitable for applications with limited space.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures stable performance during soldering processes.

Length: 5 mm

The short length makes this ADC ideal for applications where space is a constraint.

Maximum Analog Input Voltage: 2.25 V

The high maximum analog input voltage allows for versatile usage with different signal levels.

Sample Rate: 25 MHz

The high sample rate enables fast and accurate analog-to-digital conversion.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and ensures ease of soldering.

Maximum Supply Current: 31 mA

The low maximum supply current helps in conserving power and reducing energy costs.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC method offers unique features and advanced performance capabilities.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage is suitable for low-power applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The different output bit code options provide flexibility for various digital processing needs.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for high-density mounting and efficient board layout.

Minimum Analog Input Voltage: -2.25 V

The low minimum analog input voltage accommodates a wide range of signal levels.

Output Format: SERIAL, PARALLEL, WORD

The various output formats offer compatibility with different devices and communication protocols.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that this ADC is suitable for standard moisture exposure conditions.

Technical Specifications

Analog-to-Digital Converters ADC3542IRSBT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.012817 %

Sample Rate:

25 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2.25 V

Maximum Analog Input Voltage:

2.25 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

31 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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