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ADC3223IRGZT

Texas Instruments

ADC3223IRGZT by Texas Instruments

ADC3223IRGZT by Texas Instruments is a 12-bit ADC with 2 analog in channels, operating at 125 MHz sample rate. It has a package style of chip carrier and is ideal for industrial applications requiring high-speed data conversion. With a temperature range of -40 to 85°C, it offers serial output and operates on a nominal voltage of 1.8V.

Median Price

$26.905

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,330 parts In-Stock

1+ parts

$26.905

100+ parts

$23.916

1k+ parts

$17.585

10k+ parts

-

2,330

$26.905

$23.916

$17.585

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 18 parts In-Stock

1+ parts

$21.924

100+ parts

-

1k+ parts

-

10k+ parts

-

18

$21.924

-

-

-

Digiode

USA . 1,078 parts In-Stock

1+ parts

$25.560

100+ parts

-

1k+ parts

-

10k+ parts

-

1,078

$25.560

-

-

-

Vyrian

USA . 3,623 parts In-Stock

1+ parts

-

100+ parts

-

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3,623

-

-

-

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VNN

France . 2,513 parts In-Stock

1+ parts

-

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2,513

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,292 parts In-Stock

1+ parts

$15.918

100+ parts

$1,478.195

1k+ parts

$14.326

10k+ parts

-

2,292

$15.918

$1,478.195

$14.326

-

AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$16.970

100+ parts

-

1k+ parts

-

10k+ parts

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754

$16.970

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-

-

DigiPath Technology Company

USA . 450 parts In-Stock

1+ parts

$17.527

100+ parts

$16.125

1k+ parts

-

10k+ parts

-

450

$17.527

$16.125

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-

ChromeModa Solutions

Germany . 3,695 parts In-Stock

1+ parts

$17.885

100+ parts

$14.666

1k+ parts

-

10k+ parts

-

3,695

$17.885

$14.666

-

-

IDEA Electronic Components Group

UK . 1,309 parts In-Stock

1+ parts

$17.885

100+ parts

$16.991

1k+ parts

$16.096

10k+ parts

-

1,309

$17.885

$16.991

$16.096

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Ampacity Inc.

Singapore . 2,293 parts In-Stock

1+ parts

$22.870

100+ parts

-

1k+ parts

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10k+ parts

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2,293

$22.870

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-

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Corphita

USA . 2,804 parts In-Stock

1+ parts

$24.214

100+ parts

-

1k+ parts

-

10k+ parts

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2,804

$24.214

-

-

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Overview

Unlock the power of precision with the Texas Instruments ADC3223IRGZT Analog-to-Digital Converter. Crafted with superior quality and expertise, this device offers unparalleled accuracy and reliability in converting analog signals to digital data. Ideal for a wide range of applications, this converter excels in delivering high-performance results. Experience the value of seamless integration, efficient operation, and enhanced functionality with the ADC3223IRGZT. Elevate your projects with this state-of-the-art solution from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

No. of Analog In Channels: 2

With 2 channels, this product can handle inputs from multiple sources simultaneously, increasing versatility.

Surface Mount: YES

With surface mount capability, this product is easy to integrate into circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square shape allows for efficient placement on a circuit board, optimizing space utilization.

No. of Bits: 12

The 12-bit resolution offers high accuracy in converting analog signals to digital, making it ideal for precision measurements.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options for interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides enhanced heat dissipation and a compact form factor, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can function in cold conditions without issues.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position simplifies installation and enhances stability in the circuit.

Maximum Seated Height: 1 mm

The low-profile design of 1 mm height allows for compact integration in space-constrained applications.

Width: 7 mm

The 7 mm width allows for easy placement on a standard circuit board, simplifying design and assembly.

Maximum Time At Peak Reflow Temperature (s): 30

This time specification ensures efficient and controlled soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables secure soldering connections for durability.

Length: 7 mm

At 7 mm length, this product is compact and suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows for reliable operation in various industrial settings.

Maximum Analog Input Voltage: 2 V

With a maximum input voltage of 2V, this product can handle a wide range of analog signals effectively.

Sample Rate: 125 MHz

The high sample rate of 125 MHz ensures fast and accurate signal conversion for real-time applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and enhances electrical conductivity.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC conversion method offers unique features and performance advantages.

Nominal Supply Voltage: 1.8 V

The 1.8V supply voltage is ideal for low-power applications, maximizing energy efficiency.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The output bit code options provide flexibility in data processing and compatibility with different systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise and compact connection with other components.

Minimum Analog Input Voltage: -2 V

With a minimum input voltage of -2V, this product can handle a wide range of analog signals effectively.

Output Format: SERIAL

The serial output format allows for easy data transmission and integration with digital systems.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this product has moderate moisture sensitivity, suitable for various operating environments.

Technical Specifications

Analog-to-Digital Converters ADC3223IRGZT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

ADC3223IRGZT Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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