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ADC3243IRGZ25

Texas Instruments

ADC3243IRGZ25 by Texas Instruments

Texas Instruments ADC3243IRGZ25 is a 14-bit ADC with 2 analog in channels, operating at 80 MHz sample rate. It has a supply voltage of 1.8V and can handle max analog input voltage of ±2V. Ideal for industrial applications requiring high-speed data conversion in compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,919 parts In-Stock

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Digiode

USA . 287 parts In-Stock

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287

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Distributors (Availability)

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Parana Technologies

USA . 258 parts In-Stock

1+ parts

$9.929

100+ parts

-

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$10.494

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258

$9.929

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$10.494

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DigiPath Technology Company

USA . 1,080 parts In-Stock

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$10.933

100+ parts

$10.058

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$10.933

$10.058

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ChromeModa Solutions

Germany . 2,855 parts In-Stock

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$11.156

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$9.148

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$11.156

$9.148

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IDEA Electronic Components Group

UK . 1,327 parts In-Stock

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$11.156

100+ parts

$10.598

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$10.040

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1,327

$11.156

$10.598

$10.040

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AZTECH Wire

Italy . 772 parts In-Stock

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$18.047

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772

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One Stop Electronics

USA . 203 parts In-Stock

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$34.000

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203

$34.000

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QUARKTWIN TECHNOLOGY LTD

USA . 23,517 parts In-Stock

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Microchip USA

USA . 4,554 parts In-Stock

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Corphita

USA . 1,274 parts In-Stock

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Native Components

USA . 661 parts In-Stock

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Northwest PG Solutions

USA . 591 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the Texas Instruments ADC3243IRGZ25 Analog-to-Digital Converter. Crafted with top-notch materials and cutting-edge technology, this product offers exceptional performance in a wide range of applications. From industrial automation to automotive systems, this converter delivers accurate and efficient results. Trust Texas Instruments to provide you with quality products that exceed expectations. Upgrade your systems today and discover the value and benefits that the ADC3243IRGZ25 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and lightweight, making the product suitable for a wide range of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in capturing and converting analog signals simultaneously.

Surface Mount: YES

Surface mount capability makes installation and assembly easier, saving time and effort.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the PCB.

No. of Bits: 14

With 14 bits resolution, the converter can provide high accuracy and precision in digitizing analog signals.

Power Supplies (V): 1.8

Operating with a low supply voltage of 1.8V, the product is energy efficient and suitable for low power applications.

No. of Terminals: 48

Having 48 terminals allows for multiple connections and interfaces, enhancing connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink, and thin profile design ensures efficient heat dissipation and space-saving on the PCB.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C, the product is suitable for use in extreme cold environments.

Technical Specifications

Analog-to-Digital Converters ADC3243IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

80 MHz

Electrical Specifications

Power Supplies:

1.8 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADC3243IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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