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ADC3662IRSBR

Texas Instruments

ADC3662IRSBR by Texas Instruments

Texas Instruments ADC3662IRSBR is a 16-bit ADC with 2 analog in channels, 25 MHz sample rate, and 0.007629% max linearity error. Ideal for applications requiring high-speed data conversion like industrial automation and telecommunications due to its serial output format and low supply current of 42 mA.

Median Price

$61.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,916 parts In-Stock

1+ parts

$61.200

100+ parts

$54.400

1k+ parts

$40.000

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12,916

$61.200

$54.400

$40.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$40.000

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48

$40.000

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Digiode

USA . 3,141 parts In-Stock

1+ parts

$58.140

100+ parts

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3,141

$58.140

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VNN

France . 4,770 parts In-Stock

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4,770

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Vyrian

USA . 3,762 parts In-Stock

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3,762

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Sensible Micro Corp

USA . 7 parts In-Stock

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7

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Distributors (Availability)

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AZTECH Wire

Italy . 251 parts In-Stock

1+ parts

$14.210

100+ parts

-

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251

$14.210

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Corohmni

South Africa . 89 parts In-Stock

1+ parts

$17.202

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89

$17.202

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Continental Prestige Electronics

USA . 3,982 parts In-Stock

1+ parts

$40.000

100+ parts

-

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$39.200

3,982

$40.000

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-

$39.200

Netroflash

USA . 500 parts In-Stock

1+ parts

$40.000

100+ parts

-

1k+ parts

$38.000

10k+ parts

$37.200

500

$40.000

-

$38.000

$37.200

Ampacity Inc.

Singapore . 12,516 parts In-Stock

1+ parts

$52.020

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12,516

$52.020

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Corphita

USA . 651 parts In-Stock

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$55.080

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651

$55.080

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QUARKTWIN TECHNOLOGY LTD

USA . 11,419 parts In-Stock

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11,419

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Argo Parts USA

USA . 3,110 parts In-Stock

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Overview

Experience unparalleled precision and performance with the ADC3662IRSBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that cater to a variety of applications. This cutting-edge product boasts a 16-bit resolution, ensuring accurate conversions with minimal error. With a compact design and efficient operation, this ADC offers exceptional value to customers looking for reliable and high-performing solutions. Upgrade your system with the ADC3662IRSBR and experience the difference in quality and efficiency.

Feature Benefit Bullets

No. of Bits: 16

Higher number of bits allows for more precise conversion of analog signals into digital data, providing accurate and detailed measurements.

Maximum Linearity Error (EL): 0.007629 %

Low linearity error ensures that the converted digital output closely matches the input analog signal, leading to accurate and reliable measurements.

Sample Rate: 25 MHz

High sample rate allows for fast and efficient conversion of analog signals, making this product suitable for applications that require high-speed data acquisition.

Nominal Supply Voltage: 1.8 V

Low supply voltage requirement allows for energy-efficient operation and can be beneficial for portable or battery-powered devices.

Output Format: SERIAL

Serial output format enables easy integration with digital systems and communication interfaces, making it versatile and compatible with a wide range of applications.

Technical Specifications

Analog-to-Digital Converters ADC3662IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.007629 %

Sample Rate:

25 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

42 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3662IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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