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ADC3242IRGZ25

Texas Instruments

ADC3242IRGZ25 by Texas Instruments

ADC3242IRGZ25 by Texas Instruments is a 14-bit ADC with 2 analog input channels, operating at a sample rate of 50 MHz. It has a supply voltage of 1.8V and supports both offset binary and 2's complement binary output formats. Ideal for industrial applications requiring high-speed data conversion in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,116 parts In-Stock

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Digiode

USA . 616 parts In-Stock

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616

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Native Components

USA . 990 parts In-Stock

1+ parts

$0.040

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-

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$0.038

990

$0.040

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$0.038

AZTECH Wire

Italy . 844 parts In-Stock

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$14.288

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844

$14.288

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Parana Technologies

USA . 1,134 parts In-Stock

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$23.854

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$24.487

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$23.854

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$24.487

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ChromeModa Solutions

Germany . 4,468 parts In-Stock

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$26.802

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$21.978

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4,468

$26.802

$21.978

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IDEA Electronic Components Group

UK . 1,669 parts In-Stock

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$26.802

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$25.462

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$24.122

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1,669

$26.802

$25.462

$24.122

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One Stop Electronics

USA . 1,631 parts In-Stock

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$27.000

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1,631

$27.000

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Component Stockers USA

USA . 505 parts In-Stock

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$99.990

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505

$99.990

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Corphita

USA . 4,346 parts In-Stock

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Northwest PG Solutions

USA . 1,426 parts In-Stock

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DigiPath Technology Company

USA . 822 parts In-Stock

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$24.165

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822

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Microchip USA

USA . 207 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the Texas Instruments ADC3242IRGZ25. Crafted with precision and expertise, this high-quality converter offers unmatched performance and reliability for a wide range of applications. With its innovative design and advanced features, this product delivers exceptional value, benefits, and advantages to customers seeking top-notch signal processing solutions. Trust in Texas Instruments to provide you with the best in analog-to-digital converters and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for the conversion of two different analog signals simultaneously, increasing efficiency.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more cost-effective.

No. of Bits: 14

With 14 bits, this converter provides high precision and accuracy in converting analog signals to digital, making it suitable for demanding applications.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V reduces power consumption, ideal for portable devices or applications requiring energy efficiency.

Maximum Operating Temperature: 85 °C

The product can operate at a high temperature of 85°C, making it suitable for industrial environments where temperature fluctuations may occur.

Output Format: SERIAL

The serial output format allows for easy interfacing with other digital systems, enhancing compatibility and connectivity.

Technical Specifications

Analog-to-Digital Converters ADC3242IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

50 MHz

Electrical Specifications

Power Supplies:

1.8 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADC3242IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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