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74GTLPH1627DGGRE4

Texas Instruments

74GTLPH1627DGGRE4 by Texas Instruments

74GTLPH1627DGGRE4 by Texas Instruments is an 18-bit bus driver with a propagation delay of 7.3ns, operating at a supply voltage of 3.3V. It features GTL/P & LVTTL translation and supports common control applications in industrial settings with a temperature range from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,986 parts In-Stock

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Digiode

USA . 50 parts In-Stock

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50

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Northwest PG Solutions

USA . 1,448 parts In-Stock

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$2.369

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$2.369

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AZTECH Wire

Italy . 631 parts In-Stock

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$17.338

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Parana Technologies

USA . 487 parts In-Stock

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$26.117

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$26.705

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487

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DigiPath Technology Company

USA . 236 parts In-Stock

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$28.758

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$26.457

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236

$28.758

$26.457

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ChromeModa Solutions

Germany . 6,117 parts In-Stock

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$29.345

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$24.063

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IDEA Electronic Components Group

UK . 1,667 parts In-Stock

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$29.345

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$27.878

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$26.410

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One Stop Electronics

USA . 705 parts In-Stock

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$57.000

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Corphita

USA . 1,259 parts In-Stock

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Native Components

USA . 930 parts In-Stock

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Microchip USA

USA . 455 parts In-Stock

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Overview

Enhance your electronic designs with the 74GTLPH1627DGGRE4 by Texas Instruments, a top-quality bus driver & transceiver that delivers unmatched performance and reliability. Manufactured by a trusted industry leader, this versatile component is ideal for a wide range of applications. With its innovative design and advanced features, this product offers exceptional value and benefits to customers by providing seamless signal translation, fast propagation delay, and efficient power consumption. Upgrade your projects with the best in class technology from Texas Instruments and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package light-weight and durable, ideal for portable and rugged applications.

Propagation Delay At Nominal Supply: 7.3 ns

Low propagation delay ensures fast data transmission and minimal signal degradation, making it suitable for high-speed communication systems.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of board space and allows for easy placement on the PCB.

No. of Bits: 18

With 18 bits, this product can handle a large amount of data simultaneously, making it suitable for complex communication protocols.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with a wide range of digital systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh industrial environments without performance degradation.

Output Characteristics: 3-STATE

3-STATE output allows for multiple devices to share the same bus line without interference, enhancing system flexibility.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS, offering high speed capability and low power consumption.

Technical Specifications

Bus Driver & Transceivers 74GTLPH1627DGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PDSO-G64

Length:

17 mm

Maximum I (ol):

100 Amp

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

7.3 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTL/P & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74GTLPH1627DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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