Loading...

5962-01-186-0377

Texas Instruments

5962-01-186-0377 by Texas Instruments

Texas Instruments' 5962-01-186-0377 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85 ns max access time. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,306

-

-

-

-

Digiode

USA . 2,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,546

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 200 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$2.000

-

-

-

Parana Technologies

USA . 1,582 parts In-Stock

1+ parts

$4.380

100+ parts

-

1k+ parts

$4.796

10k+ parts

-

1,582

$4.380

-

$4.796

-

DigiPath Technology Company

USA . 1,377 parts In-Stock

1+ parts

$4.823

100+ parts

$4.437

1k+ parts

-

10k+ parts

-

1,377

$4.823

$4.437

-

-

ChromeModa Solutions

Germany . 3,170 parts In-Stock

1+ parts

$4.921

100+ parts

$4.035

1k+ parts

-

10k+ parts

-

3,170

$4.921

$4.035

-

-

IDEA Electronic Components Group

UK . 1,923 parts In-Stock

1+ parts

$4.921

100+ parts

-

1k+ parts

$4.429

10k+ parts

-

1,923

$4.921

-

$4.429

-

AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$12.716

100+ parts

-

1k+ parts

-

10k+ parts

-

235

$12.716

-

-

-

Corphita

USA . 1,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

-

-

-

-

Northwest PG Solutions

USA . 1,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,101

-

-

-

-

Native Components

USA . 948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

948

-

-

-

-

Overview

Upgrade your systems with the highly reliable 5962-01-186-0377 OTP ROM from Texas Instruments. Crafted with precision and expertise, this ceramic package offers unparalleled performance in military-grade applications. With a memory density of 4096 bits and an access time of just 85 ns, this ROM ensures seamless operation at extreme temperatures. Trust in Texas Instruments for cutting-edge technology and secure your data with the best in the industry. Experience the difference today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and thermal conductivity, making it a reliable choice for a high-performance product like OTP ROM.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most systems, enhancing ease of integration.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this OTP ROM can withstand harsh environmental conditions without compromising performance.

Organization: 512X8

The 512x8 organization provides a balanced ratio of capacity and flexibility, catering to a wide range of data storage needs.

Technology: TTL

Utilizing TTL technology ensures fast and reliable data processing, making this OTP ROM suitable for time-sensitive applications.

No. of Words: 512 words

With a large capacity of 512 words, this OTP ROM can store significant amounts of data efficiently.

Memory Density: 4096 bit

The high memory density of 4096 bit allows for compact storage of data, making this OTP ROM space-efficient.

Maximum Access Time: 85 ns

A fast maximum access time of 85 ns ensures quick retrieval of data, enhancing the overall performance of this OTP ROM.

Technical Specifications

OTP ROM 5962-01-186-0377 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

85 ns

JESD-30 Code:

R-XDIP-T20

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-186-0377 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20