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2U3837K33QDBVRG4Q1

Texas Instruments

2U3837K33QDBVRG4Q1 by Texas Instruments

2U3837K33QDBVRG4Q1 by Texas Instruments is a Power Management IC with a supply voltage range of 1.6V to 6V, suitable for automotive applications. It features a small outline package style, dual terminal position, and AEC-Q100 screening level for robust performance in harsh environments. With a compact size of 2.9mm length and 1.45mm seated height, it offers efficient power supply support in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,502 parts In-Stock

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2,502

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Digiode

USA . 679 parts In-Stock

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679

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 557 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

557

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 1,262 parts In-Stock

1+ parts

$2.500

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1,262

$2.500

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One Stop Electronics

USA . 294 parts In-Stock

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$5.500

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294

$5.500

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Parana Technologies

USA . 1,285 parts In-Stock

1+ parts

$7.351

100+ parts

$682.689

1k+ parts

$6.616

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1,285

$7.351

$682.689

$6.616

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DigiPath Technology Company

USA . 653 parts In-Stock

1+ parts

$8.095

100+ parts

$7.447

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653

$8.095

$7.447

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ChromeModa Solutions

Germany . 4,453 parts In-Stock

1+ parts

$8.260

100+ parts

$6.773

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4,453

$8.260

$6.773

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IDEA Electronic Components Group

UK . 714 parts In-Stock

1+ parts

$8.260

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$7.434

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714

$8.260

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$7.434

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AZTECH Wire

Italy . 392 parts In-Stock

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$8.860

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392

$8.860

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Corphita

USA . 1,187 parts In-Stock

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Native Components

USA . 618 parts In-Stock

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618

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Northwest PG Solutions

USA . 471 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 73 parts In-Stock

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Overview

Unlock the power of reliable and efficient Power Management ICs with the 2U3837K33QDBVRG4Q1 by Texas Instruments. Designed with high-quality materials and rigorous testing, this small outline, low profile IC offers automotive-grade performance for a wide range of applications. With a nominal supply voltage of 1.8V and maximum operating temperature of 125°C, this IC provides stable power supplies at 3.3V with dual terminals for easy installation. Experience peace of mind knowing your devices are powered by the best in the industry, delivering optimal performance and longevity. Upgrade to the 2U3837K33QDBVRG4Q1 for unmatched quality and reliability in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable solution for the power management IC.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Screening Level: AEC-Q100

Ensures high reliability and quality, suitable for automotive applications.

Nominal Supply Voltage (Vsup): 1.8 V

Optimal voltage for the power management IC to operate efficiently and effectively.

Power Supplies (V): 3.3

Provides stable power supply for connected devices.

No. of Terminals: 5

Offers sufficient connectivity options for various system configurations.

Maximum Operating Temperature: 125 °C

Can withstand high temperature conditions, ideal for automotive environments.

Minimum Operating Temperature: -40 °C

Operates reliably even in very cold conditions, ensuring consistent performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term use.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering processes, ensuring secure connections.

Technical Specifications

Power Management ICs 2U3837K33QDBVRG4Q1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

2U3837K33QDBVRG4Q1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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